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PC Material Waffle Pack Chip Tray Series For LED Chips Packaging Solution

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China Shenzhen Hiner Technology Co.,LTD certification
China Shenzhen Hiner Technology Co.,LTD certification
Customer Reviews
I was very impressed!The collaboration with Hiner-Pack went very well and fully met our Jedec customization needs, and as I mentioned, we will definitely buy more trays from this company.

—— Kenneth Duvander

Chinese suppliers who have bought the best trays so far will choose to cooperate with more projects in the future.

—— Mara Lund

こんかい今回のhiner-packのせー制ひん品トレイはほんとー本当にすばらしー素晴らしいです。すぐれ優れたひんしつ品質とせーのー性能におどろき驚きました。つぎ次のごきょーりょく協力をたのしみ楽しみにしています。

—— 本間宏紀

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—— 김종운

The goods were delivered on time and the quality was much better than I expected. Hiner-pack is really a trustworthy company!

—— George Bush

The service attitude of the company is very good, and the packing specifications of the goods are completed according to our requirements. What a great Chinese company!

—— Mariah Carey

Nous avons reçu vos produits. Le prix est bas et de haute qualité. Nous sommes très heureux de coopérer avec vous cette fois!

—— Jacqueline Bourgeois

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PC Material Waffle Pack Chip Tray Series For LED Chips Packaging Solution

PC Material Waffle Pack Chip Tray Series For LED Chips Packaging Solution
PC Material Waffle Pack Chip Tray Series For LED Chips Packaging Solution PC Material Waffle Pack Chip Tray Series For LED Chips Packaging Solution PC Material Waffle Pack Chip Tray Series For LED Chips Packaging Solution PC Material Waffle Pack Chip Tray Series For LED Chips Packaging Solution

Large Image :  PC Material Waffle Pack Chip Tray Series For LED Chips Packaging Solution

Product Details:
Place of Origin: Made In China
Brand Name: Hiner-pack
Certification: ISO 9001 ROHS SGS
Model Number: HN21131
Payment & Shipping Terms:
Minimum Order Quantity: 1000
Price: $0.35~$0.85(Prices are determined according to different incoterms and quantities)
Packaging Details: It depends on the QTY of order and size of product
Delivery Time: 5~8 working days
Payment Terms: T/T
Supply Ability: The capacity is between 4000PCS~5000PCS/per day

PC Material Waffle Pack Chip Tray Series For LED Chips Packaging Solution

Description
Material: PC Color: Black
Matrix QTY: 18*15-16=254PCS Place Of Origin: CHINA
Surface Resistance: 1.0x10E4~1.0x10E11Ω Clean Class: General And Ultrasonic Cleaning
Injection Mold: Lead Time 20~25Days,Mold Life Span: 30~450,000 Times Molding Method: Injection Moulding
High Light:

Injection Moulding Waffle Packs Tray

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PC Material Waffle Pack Tray

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LED Chips Waffle Pack Tray

Waffle Pack Chip Tray Series For LED Chips Packaging Solution

 

To protect IC or conponents during shipments, It is critically important to choose the right supply form and packaging.Movement of the product within the container, contact with upper surfaces, electrostatic discharge (ESD), or exposure to air can damage the product.

 

Hiner-pack offers a wide selections of products to meet your specific bare die, chip scale, package shipping and handling needs. As packaging experts, we can help you choose the waffle pack that best meets your manufacturing needs while protecting your bare die from corrosion and ESD.

 

Details Of HN21131 Chip Tray

 

The HN21131 waffle pack is mainly made of PC. The material has good stability and can protect customers' electronic products well. The matrix design of 18*15-16 can also load more customers' products. In addition, multiple trays can overlap, increasing the storage of products and saving shipping costs.

 

Outline Line Size 50*50*4.5mm Brand Hiner-pack
Model HN21131 Package Type Die
Cavity Size 1.4*1.8*0.9 Matrix QTY 18*15-16=254PCS
Material PC Flatness MAX 0.2mm
Color Black Service Accept OEM,ODM
Resistance 1.0x10e4-1.0x10e11Ω Certificate ROHS SGS

 

Application Of HN21131 Chip Tray

 

Electronic Components              Semiconductor

Embedded System                     Micro and Anon System

Outline Size Material Surface Resistance Service Flatness Color
2" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.2mm Customizable
3" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.25mm Customizable
4" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.3mm Customizable
Custom size ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM TBC Customizable
Provide professional design and packaging for your products

 

Advantages

1. Light weight, saving transportation and packaging costs.
2. Size specification, compatible in any 2 ", 3 "or 4" Waffle Pack Feeder Machine.
3. Good anti-static performance, effectively ensure that the product is not damaged by anti-static release.
4. High temperature resistance, suitable for high temperature automation equipment assembly.
5. Corrosion resistance, suitable for all kinds of production conditions of products.
6. Matrix arrangement design, under the premise of protecting the product, the maximum capacity design, cost saving.

 

PC Material Waffle Pack Chip Tray Series For LED Chips Packaging Solution 0

FAQ

 

Q1: Are You Manufacturer or Trade Company?

Ans:We are the 100% Manufacturer specialized in packaging over 10 years with 1500 square meters workshop area, located in Shenzhen China.

Q2: What is the material of your product?

Ans:ABS.PC.PPE.MPPO.PEI.HIPS...etc

Q3. Can I order if quantity less than MOQ?
Ans:Yes and it would be taken as sample order to production. We take more serious on sample order.
Q4. Can I get Free Samples?
Ans:Yes, If samples we have in stock would be provided for testing, but shipment should at your side.If samples are needed to customize with your logo and designs, please send us designs and advise chip, quantity, and any other details required. 

Q5: Could you put my logo in our product?
Ans:Yes, we can put your logo in our product, show us your logo firstly please.

Q6. Do you arrange shipment for the products?

Ans:It’s depends on our incoterms.If FOB or CIF price, we will arrange shipment for you, but EXW price, clients need to arrange shipment by themselves or their agents.

 

Other similar matching series product photo reference:PC Material Waffle Pack Chip Tray Series For LED Chips Packaging Solution 1

Contact Details
Shenzhen Hiner Technology Co.,LTD

Contact Person: Rainbow Zhu

Tel: 86 15712074114

Fax: 86-0755-29960455

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