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Black Dustproof 2 Inch Waffle Pack Chip Tray For IC Storage

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China Shenzhen Hiner Technology Co.,LTD certification
China Shenzhen Hiner Technology Co.,LTD certification
Customer Reviews
I was very impressed!The collaboration with Hiner-Pack went very well and fully met our Jedec customization needs, and as I mentioned, we will definitely buy more trays from this company.

—— Kenneth Duvander

Chinese suppliers who have bought the best trays so far will choose to cooperate with more projects in the future.

—— Mara Lund

こんかい今回のhiner-packのせー制ひん品トレイはほんとー本当にすばらしー素晴らしいです。すぐれ優れたひんしつ品質とせーのー性能におどろき驚きました。つぎ次のごきょーりょく協力をたのしみ楽しみにしています。

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—— 김종운

The goods were delivered on time and the quality was much better than I expected. Hiner-pack is really a trustworthy company!

—— George Bush

The service attitude of the company is very good, and the packing specifications of the goods are completed according to our requirements. What a great Chinese company!

—— Mariah Carey

Nous avons reçu vos produits. Le prix est bas et de haute qualité. Nous sommes très heureux de coopérer avec vous cette fois!

—— Jacqueline Bourgeois

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Black Dustproof 2 Inch Waffle Pack Chip Tray For IC Storage

Black Dustproof 2 Inch Waffle Pack Chip Tray For IC Storage
Black Dustproof 2 Inch Waffle Pack Chip Tray For IC Storage Black Dustproof 2 Inch Waffle Pack Chip Tray For IC Storage Black Dustproof 2 Inch Waffle Pack Chip Tray For IC Storage Black Dustproof 2 Inch Waffle Pack Chip Tray For IC Storage

Large Image :  Black Dustproof 2 Inch Waffle Pack Chip Tray For IC Storage

Product Details:
Place of Origin: Made In China
Brand Name: Hiner-pack
Certification: ISO 9001 ROHS SGS
Model Number: HN22029
Payment & Shipping Terms:
Minimum Order Quantity: 1000
Price: $0.35~$0.85(Prices are determined according to different incoterms and quantities)
Packaging Details: It depends on the QTY of order and size of product
Delivery Time: 5~8 working days
Payment Terms: T/T
Supply Ability: The capacity is between 4000PCS~5000PCS/per day

Black Dustproof 2 Inch Waffle Pack Chip Tray For IC Storage

Description
Material: PC Color: Black
Matrix QTY: 15*11=165PCS Place Of Origin: CHINA
Surface Resistance: 1.0x10E4~1.0x10E11Ω Clean Class: General And Ultrasonic Cleaning
Injection Mold: Lead Time 20~25Days,Mold Life Span: 30~450,000 Times Molding Method: Injection Moulding
High Light:

Black 2 Inch Waffle Pack

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Dustproof 2 Inch Waffle Pack

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IC Storage Waffle Pack Chip Trays

Black Dustproof 2 Inch Waffle Pack Chip Tray for IC Storage

 

The waffle pack is utilized for the transportation and storage of chips, with the intention of minimizing chip exposure to air. It is imperative that bare hands do not come into contact with chip product storage containers, even when outside clean areas. Regular cleaning of chip tray product is necessary, and if visible contaminants are detected, immediate cleaning of the waffle pack must be carried out.

 

In addition, some thin products loaded in these waffle trays may shift during transportation, resulting in collision damage or products falling out of the lattice. To address this issue, a matching lid and clamp have been specially developed for use with the trays. The clamp securely fastens the tray and lid together to prevent any incidents of detachment.

 

The Details of the HN22029 Waffle Pack Chip Tray

 

The HN22029 waffle pack is primarily composed of polycarbonate (PC) material, a widely utilized industrial substance renowned for its exceptional structural stability and heat resistance properties. Its tray features an evenly distributed matrix pocket design that optimizes loading efficiency through professional matrix engineering. Customers can select the appropriate waffle pack size based on their product dimensions, while the 45-degree chamfer design effectively prevents stacking errors.

 

Meanwhile, the service life of this waffle pack is 5-7 times longer than that of traditional packaging. Moreover, it can be easily recycled after disposal without causing any environmental pollution concerns for customers. As a professional tray manufacturer, Hiner-pack strictly controls every step and operation from design drawing to mold manufacturing, production and packaging to ensure quality service delivery.

 

Outline Line Size 50.8*50.8*4mm Brand Hiner-pack
Model HN22029 Package Type Die
Cavity Size 2.3*3.5*0.4 Matrix QTY 15*11=165PCS
Material PC Feature ESD,Dustproof
Color Black Service Accept OEM,ODM
Resistance 1.0x10e4-1.0x10e11Ω Certificate ROHS SGS

 

Product Application

 

Electronic Component                  Embedded System

Micro and Anon System               Sensor Test and Measurement Technology

Outline Size Material Surface Resistance Service Flatness Color
2" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.2mm Customizable
3" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.25mm Customizable
4" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.3mm Customizable
Custom size ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM TBC Customizable
Provide professional design and packaging for your products

 

Advantages

1.Light weight, saving transportation and packaging costs.

2.Size specification, compatible in any 2 ", 3 "or 4" Waffle Pack Feeder Machine.

3.Good anti-static performance, effectively ensure that the product is not damaged by anti-static release.

4.High temperature resistance, suitable for high temperature automation equipment assembly.

5.Corrosion resistance, suitable for all kinds of production conditions of products.

Black Dustproof 2 Inch Waffle Pack Chip Tray For IC Storage 0

FAQ

Q1: Are You Manufacturer or Trade Company?

Ans:We are the 100% Manufacturer specialized in packaging over 10 years with 1500 square meters workshop area, located in Shenzhen China.

Q2: What is the material of your product?

ABS.PC.PPE.MPPO.PEI.HIPS...etc

Q3: Can you help with the design?

Yes, we can accept your customization and do the packaging for you according to your requirement.

Q4: How can I get the quotation of the custom products ?

Let us know the size of your IC or component thickness,and then we can make a quotation for you.

Q5: Can I get some samples before making a bulk order?

Yes, the fee sample in stock can be sent, but the shipping fee should be paid by yourself.

Q6: Could you put my logo in our product?

Yes, we can put your logo in our product, show us your logo firstly please.

Q7: When can we get the samples?

We can send you them right now if you are interested in something we have stock.

Black Dustproof 2 Inch Waffle Pack Chip Tray For IC Storage 1

Contact Details
Shenzhen Hiner Technology Co.,LTD

Contact Person: Rainbow Zhu

Tel: 86 15712074114

Fax: 86-0755-29960455

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