|Matrix QTY:||15*11=165PCS||Place Of Origin:||CHINA|
|Surface Resistance:||1.0x10E4~1.0x10E11Ω||Clean Class:||General And Ultrasonic Cleaning|
|Injection Mold:||Lead Time 20~25Days,Mold Life Span: 30~450,000 Times||Molding Method:||Injection Moulding|
Black 2 Inch Waffle Pack,
Dustproof 2 Inch Waffle Pack,
IC Storage Waffle Pack Chip Trays
Black Dustproof 2 Inch Waffle Pack Chip Tray for IC Storage
The waffle pack is utilized for the transportation and storage of chips, with the intention of minimizing chip exposure to air. It is imperative that bare hands do not come into contact with chip product storage containers, even when outside clean areas. Regular cleaning of chip tray product is necessary, and if visible contaminants are detected, immediate cleaning of the waffle pack must be carried out.
In addition, some thin products loaded in these waffle trays may shift during transportation, resulting in collision damage or products falling out of the lattice. To address this issue, a matching lid and clamp have been specially developed for use with the trays. The clamp securely fastens the tray and lid together to prevent any incidents of detachment.
The Details of the HN22029 Waffle Pack Chip Tray
The HN22029 waffle pack is primarily composed of polycarbonate (PC) material, a widely utilized industrial substance renowned for its exceptional structural stability and heat resistance properties. Its tray features an evenly distributed matrix pocket design that optimizes loading efficiency through professional matrix engineering. Customers can select the appropriate waffle pack size based on their product dimensions, while the 45-degree chamfer design effectively prevents stacking errors.
Meanwhile, the service life of this waffle pack is 5-7 times longer than that of traditional packaging. Moreover, it can be easily recycled after disposal without causing any environmental pollution concerns for customers. As a professional tray manufacturer, Hiner-pack strictly controls every step and operation from design drawing to mold manufacturing, production and packaging to ensure quality service delivery.
|Outline Line Size||50.8*50.8*4mm||Brand||Hiner-pack|
|Cavity Size||2.3*3.5*0.4||Matrix QTY||15*11=165PCS|
Electronic Component Embedded System
Micro and Anon System Sensor Test and Measurement Technology
|Outline Size||Material||Surface Resistance||Service||Flatness||Color|
|Provide professional design and packaging for your products|
1.Light weight, saving transportation and packaging costs.
2.Size specification, compatible in any 2 ", 3 "or 4" Waffle Pack Feeder Machine.
3.Good anti-static performance, effectively ensure that the product is not damaged by anti-static release.
4.High temperature resistance, suitable for high temperature automation equipment assembly.
5.Corrosion resistance, suitable for all kinds of production conditions of products.
Q1: Are You Manufacturer or Trade Company?
Ans:We are the 100% Manufacturer specialized in packaging over 10 years with 1500 square meters workshop area, located in Shenzhen China.
Q2: What is the material of your product?
Q3: Can you help with the design?
Yes, we can accept your customization and do the packaging for you according to your requirement.
Q4: How can I get the quotation of the custom products ?
Let us know the size of your IC or component thickness,and then we can make a quotation for you.
Q5: Can I get some samples before making a bulk order?
Yes, the fee sample in stock can be sent, but the shipping fee should be paid by yourself.
Q6: Could you put my logo in our product?
Yes, we can put your logo in our product, show us your logo firstly please.
Q7: When can we get the samples?
We can send you them right now if you are interested in something we have stock.
Contact Person: Rainbow Zhu
Tel: 86 15712074114