|Surface Resistance:||1.0x10E4~1.0x10E11Ω||Flatness:||Less Than 0.76mm|
|Clean Class:||General And Ultrasonic Cleaning||Incoterms:||EXW,FOB,CIF,DDU,DDP|
|Customized Service:||Support Standard And Non-standard,precision Machining||Injection Mold:||Customized Case Need(Lead Time 25~30Days,Mold Life Span: 300,000 Times.)|
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PES Heat Resistance Thermal JEDEC Matrix Tray for Electronic Parts
JEDEC trays are widely used in the microelectronics industry to securely handle, transport and store modules or other components. It is mainly made of plastic compound injection molding to support high quality, fast manufacturing. The design of the tray has also been updated and developed, with flat cells in the central area of the tray, allowing automated equipment to pick up. At the same time, the 45 degree chamfer design also increases the efficiency of automation equipment. The use of JECEC tray with typical features/sizes maximizes utility and minimizes tray manufacturing difficulty, preventing damage to electronic equipment.
The Details of the HN22037 JEDEC Matrix Tray
The HN22037 JEDEC matrix tray is made primarily from PES materials, which has excellent ability to withstand prolonged exposure to high temperatures in air and water. Although PES is a high-temperature engineered thermoplastic, it can be processed in conventional plastic processing equipment. Because PES is amorphous and has a low die shrinkage, it is suitable for applications requiring small tolerances and small dimensional variations over a wide temperature range. These give it light weight, good impact resistance, dimensional stability and chemical resistance.
|Outline Line Size||322.6*135.9*12.19mm||Brand||Hiner-pack|
|Cavity Size||6.2*5.22*2.25mm||Matrix QTY||11*28=308PCS|
Applications of the Matrix Tray
Printed Circuits High Intensity Light Bases
Safety Face Shields Machine Guards
|Material||Bake Temperature||Surface Resistance|
|PPE||Bake 125°C~Max 150°C||1.0*10E4Ω~1.0*10E11Ω|
|MPPO+Carbon Fiber||Bake 125°C~Max 150°C||1.0*10E4Ω~1.0*10E11Ω|
|MPPO+Carbon Powder||Bake 125°C~Max 150°C||1.0*10E4Ω~1.0*10E11Ω|
|MPPO+Glass Fiber||Bake 125°C~Max 150°C||1.0*10E4Ω~1.0*10E11Ω|
|PEI+Carbon Fiber||Max 180°C||1.0*10E4Ω~1.0*10E11Ω|
|Color, temperature and other special requirements can be customized|
1. We have sample stock, also can help the client to choose which type is suitable for them.
2. We will reply you in any time if you have questions.
3. Choose suitable product for clients according to clients' requirement.
4. After mold customization, free samples will be provided until the customer tests OK, so as to remove the mass production quality concerns of customers before quantity.
Q1: Are You Manufacturer or Trade Company?
Ans:We are the 100% Manufacturer specialized in packaging over 10 years with 1500 square meters workshop area, located in Shenzhen China.
Q2: What is the material of your product?
Q3: Can you help with the design?
Yes, we can accept your customization and do the packaging for you according to your requirement.
Q4: How can I get the quotation of the custom products ?
Let us know the size of your IC or component thickness,and then we can make a quotation for you.
Q5: Can I get some samples before making a bulk order?
Yes, the fee sample in stock can be sent, but the shipping fee should be paid by yourself.
Q6: Could you put my logo in our product?
Yes, we can put your logo in our product, show us your logo firstly please.
Q7: When can we get the samples?
We can send you them right now if you are interested in something we have stock.
Contact Person: Rainbow Zhu
Tel: 86 15712074114