|Surface Resistance:||1.0x10E4~1.0x10E11Ω||Flatness:||Less Than 0.76mm|
|Clean Class:||General And Ultrasonic Cleaning||Incoterms:||EXW,FOB,CIF,DDU,DDP|
|Customized Service:||Support Standard And Non-standard,precision Machining||Injection Mold:||Customized Case Need(Lead Time 25~30Days,Mold Life Span: 300,000 Times.)|
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Heat Resistant Black JEDEC Trays for Electronic Parts
The JEDEC was founded in 1958 as part of the Federation of Electronics Industry Associations (EIA) to set standards for the emerging semiconductor industry. JEDEC standard mainly includes terminology, definition, product characteristic description and operation, test method, production support function and so on. These standards also avoid the production of marginal standards and ensure that all standards are formed based on a broad industry consensus. This also makes it easier for the JEDEC standard to gain widespread adoption in the marketplace.
The Details of the HN22039 JEDEC Tray
HN22024 trays are molded from industrial raw materials with specific matrix pockets corresponding to the dimensions of the customer's electronics. At the same time, the adsorption area is designed in the middle of the tray cavity, so as to facilitate the automatic equipment to pick up the installed products. The proper pocket size not only fits the product perfectly, but also provides comprehensive protection in different environments.
In addition, the tray material PES has low water absorption, avoiding the impact of wet environment on customers' products. At the same time, general electronic products also need to be baked before assembly to avoid moisture inside the product. This means that the tray also needs to have good temperature resistance. The 45 degree chamfering design is also easier for equipment to identify and locate, so as to achieve the effect of automatic use and reduce labor costs.
|Outline Line Size||322.6*135.9*12.19mm||Brand||Hiner-pack|
|Cavity Size||7.80*18.35*2.8mm||Matrix QTY||11*6=66PCS|
The Application of the HN22039 Matrix Tray
Electronic Component Power Supply
Optical Industry Military Industry
|Material||Bake Temperature||Surface Resistance|
|PPE||Bake 125°C~Max 150°C||
|MPPO+Carbon Fiber||Bake 125°C~Max 150°C||1.0*10E4Ω~1.0*10E11Ω|
|MPPO+Carbon Powder||Bake 125°C~Max 150°C||1.0*10E4Ω~1.0*10E11Ω|
|MPPO+Glass Fiber||Bake 125°C~Max 150°C||1.0*10E4Ω~1.0*10E11Ω|
|PEI+Carbon Fiber||Max 180°C||1.0*10E4Ω~1.0*10E11Ω|
|Color, temperature and other special requirements can be customized|
1. We have sample stock, also can help the client to choose which type is suitable for them.
2. We will reply you in any time if you have questions.
3. Choose suitable product for clients according to clients' requirement.
4. After mold customization, free samples will be provided until the customer tests OK, so as to remove the mass production quality concerns of customers before quantity.
1. How can I get a quotation?
Reply:Please provide the details of your requirements as clear as possible. So we can send you the offer at the first time.
For purchasing or further discussion, it is better to contact us with Skype / Email / Phone / Whats app, in case of any delays.
2. How long will it take to get a response?
Reply:We will reply to you within 24 hours of working day.
3. What kind of service we provide?
Reply:We can design IC Tray drawings in advance based on your clear description of the IC or component.Provide one-stop service from design to packaging and shipping.
4. What is your terms of delivery?
Reply:We accept EXW,FOB,CIF,DDU,DDP etc. You can choose the one which is the most convenient or cost effective for you.
5. How to guarantee quality?
Reply:Our samples through strict testing, the finished products comply with the international JEDEC standards, to ensure 100% qualified rate.
Contact Person: Rainbow Zhu
Tel: 86 15712074114