Product Details:
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Color: | Black | Size: | 322.6*135.9mm |
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IC Type: | BGA,QFP,QFN,LGA,PGA | Tray Features: | Stackable |
Surface Resistance: | 1.0*10e4-1.0*10e11Ω | Tray Weight: | 120~200g |
Application: | IC Packaging | Tray Shape: | Rectangular |
Highlight: | IC Packaging Jedec IC Trays,BGA Jedec IC Trays,Black IC matrix trays |
JEDEC matrix trays generally have the same measurements, which are 12.7 x 5.35 inches (322.6 x 136mm).
The thickness of the low profile trays ranges from 0.25-inch (6.35mm). This size can easily fit most standard component, such as BGA, CSP, QFP, TQFP, QFN, TSOP and SOIC.
Standardization – JEDEC IC matrix trays offer compatibility with most semiconductor manufacturing equipment. With decades of history and familiarity, support products for JEDEC matrix trays are widespread and global.
Packaging – at their core, trays are simply containers. The JEDEC matrix tray outline includes features for stacking, whereby each successive tray becomes the cover for the tray below.
Transportation & Storage – parts loaded into stacked JEDEC matrix trays are easy to store or transport, across the room or around the world. JEDEC matrix trays also function as process “boats”, transporting their contents through a variety of process tools and equipment.
Protection – JEDEC matrix trays protect the parts they hold from mechanical damage. Most JEDEC matrix trays are manufactured using materials that also provide electrical protection from electrostatic discharge (ESD) damage. This protection helps assure the parts arrive in pristine condition.
are well-suited for automatically handling and protecting parts precisely in an automated environment. Ornemonents components in a well-defined pattern, they make automation and the correlated programming operations simpler. As JEDEC Matrix Trays are utilized for semiconductors, electronic components, optical and photonic items, and purely mechanical components.
The prime reasons for picking and placement automation and usage of standardized processing apparatus are the most common reasons why companies prefer of using JEDEC Matrix Trays. A majority of these trays are manufactured of ESD-safe engineering plastic.
Hiner-pack's JEDEC TRAY SERIES are the perfect choice for Electronic Components IC Chips and ICs. With ISO 9001 SGS ROHS certification, the trays offer a minimum order quantity of 500, with a packaging option of 80~100pcs/carton. Delivery time is 1~2 Weeks, and payment terms are 100% Prepayment. The trays come with an impressive supply ability of 2000PCS/Day, and are made of quality materials such as MPPO.PPE.ABS.PEI.IDP. The tray shape is rectangular, with a height of 7.62mm, and they come in black. These trays are perfect for Grid Cable Tray and IC Tray packaging applications.
Hiner-pack is proud to offer custom JEDEC IC Trays. Our JEDEC Tray Series are designed to meet the needs of any industry, and come with the following features:
Our custom JEDEC IC Trays are designed to meet the needs of any industry. Contact us today to learn more about our JEDEC Tray Series.
Contact Person: Rainbow Zhu
Tel: 86 15712074114
Fax: 86-0755-29960455