7.62mm Jedec IC Trays,
Surface Resistant Jedec IC Trays,
IC Packaging Jedec Trays
Outlining all JEDEC matrix trays dimensions, twelve point seven by five point thirty five inches (322.6 x 136mm) is a standard measure. Furthermore, component pieces such as BGA, CSP, QFP, TQFP, QFN, TSOP, and SOIC are able to fit in low profile trays with a thickness of 0.25-inch (6.35mm). This thickness is adequate for ninety percent of the standard sizes.
JEDEC Matrix Trays are the perfect choice for a precise handling and protective environment in the automated environment. Their design helps to make automating processes easier and speeds up programming as components are assembled in a arranged pattern.
JEDEC Matrix Trays are widely used for electronics, optics and photonics and purely mechanical components. Companies often choose matrix trays for their pick and place automation and use in standardized equipment.
Most matrix trays are constructed from ESD-safe engineering plastics.
Hiner-pack JEDEC TRAY SERIES IC Trays are designed to provide ultimate protection for electronic components such as IC chips. Our trays are made of MPPO, PPE, ABS, PEI, IDP, thus ensuring superior performance and durability. With a surface resistance ranging from 1.0*10e4 to 1.0*10e11Ω, these trays are stackable and available in black color. The tray weight varies from 120~200g and they are certificated by ISO 9001 SGS ROHS.
These trays come with a minimum order quantity of 500 and are packed in 80~100pcs/carton. They are available for delivery within 1~2 weeks and payment is accepted in the form of 100% prepayment. With a daily supply ability of 2000PCS, Hiner-pack is a reliable source for Apple tray making machines and electronic components IC chips protection.
Our Hiner-pack JEDEC Tray Series is the perfect solution for IC packaging. Customize your tray to fit your exact needs with the following features:
Contact Person: Rainbow Zhu
Tel: 86 15712074114