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Product Details:
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| Application: | IC Packaging | Tray Weight: | 120~200g |
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| Tray Features: | Stackable | Material: | MPPO.PPE.ABS.PEI.IDP |
| Tray Shape: | Rectangular | IC Type: | BGA,QFP,QFN,LGA,PGA |
| Height: | 7.62mm | Size: | 322.6*135.9mm |
| High Light: | LGA IC Jedec Trays,PGA IC Jedec Trays,QFN IC Jedec Trays |
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JEDEC matrix trays measure 12.7 x 5.35 inches (322.6 x 136 mm) in width and length, respectively. These trays have a low profile thickness of 0.25-inch (6.35mm). This design is suitable for storing and transporting 90% of all standard components, such as BGA, CSP, QFP, TQFP, QFN, TSOP and SOIC.
Standardization – JEDEC IC matrix trays offer compatibility with most semiconductor manufacturing equipment. For many decades of history and wide and far application, there have been many products to support JEDEC matrix trays.
Packaging – At the heart of it all, the JEDEC matrix trays serve as containers. The outline of the JEDEC matrix trays comes with stacking capabilities, with the top tray locking the bottom one in place.
Transportation & Storage – Parts that are kept inside the stacked JEDEC matrix trays are simple to keep or tranport everywhere, be it several steps away or even cross-country. Moreover, JEDEC matrix trays also double up as “boats” during industrial processes, as they can hold the parts in transit through various process equipment.
Protection – Contained parts inside the JEDEC matrix trays are protected from mechanical damage. Moreover, most of the JEDEC matrix trays are manufactured with the material that is able to ward off ESD damage.
JEDEC Matrix Trays are designed to protect and accurately hold parts in an automated environment. This makes them ideal for companies which utilize pick and place automation systems and standardized process equipment. Not only that, they simplify automation programming tasks with their well defined component pattern.
They can be used to hold a variety of components, such as semiconductors, electronic components, optical and photonic products and purely mechanical parts. Generally, they are built with ESD-safe engineering plastic to prevent static electricity discharges.
Hiner-pack's Jedec IC Trays are the perfect solution for electronic components IC chips. With ISO 9001 SGS ROHS certification, the trays' minimum order quantity is 500 pieces and the delivery time is 1~2 weeks. Each carton contains 80~100 pieces and the tray weight is 120~200g. The trays are stackable, 7.62mm in height and suitable for IC chips like BGA, QFP, QFN, LGA and PGA. Apart from core tray racking, the trays are also applicable for IC packaging tray and IC tray.
The trays are made of high-quality material and have a strong structure, making them efficient and reliable. 2000 trays can be supplied per day and the price is TBC. Payment terms are 100% prepayment. With Hiner-pack's Jedec IC Trays, electronic components IC chips can be stored safely and securely.
Customized JEDEC Trays, from Hiner-pack, are designed for electronic components IC chipset packaging and core tray racking. The model number is JEDEC TRAY SERIES, certified with ISO 9001 SGS ROHS. The minimum order quantity is 500, and the price is TBC. The packaging details are 80~100pcs/carton, the delivery time is 1~2 weeks, and payment terms are 100% Prepayment. The supply ability is 2000PCS/Day. The tray height is 7.62mm, suitable for IC packaging like BGA, QFP, QFN, LGA, PGA, etc. The tray shape is rectangular, and the tray weight ranges from 120~200g.
Contact Person: Rainbow Zhu
Tel: 86 15712074114
Fax: 86-0755-29960455
