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High Precision Anti-Static ESD Tray Memory Integrated Circuit JEDEC IC Chip STM Tray

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China Shenzhen Hiner Technology Co.,LTD certification
China Shenzhen Hiner Technology Co.,LTD certification
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High Precision Anti-Static ESD Tray Memory Integrated Circuit JEDEC IC Chip STM Tray

High Precision Anti-Static ESD Tray Memory Integrated Circuit JEDEC IC Chip STM Tray
High Precision Anti-Static ESD Tray Memory Integrated Circuit JEDEC IC Chip STM Tray
High Precision Anti-Static ESD Tray Memory Integrated Circuit JEDEC IC Chip STM Tray High Precision Anti-Static ESD Tray Memory Integrated Circuit JEDEC IC Chip STM Tray High Precision Anti-Static ESD Tray Memory Integrated Circuit JEDEC IC Chip STM Tray High Precision Anti-Static ESD Tray Memory Integrated Circuit JEDEC IC Chip STM Tray High Precision Anti-Static ESD Tray Memory Integrated Circuit JEDEC IC Chip STM Tray

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Product Details:
Place of Origin: Made In China
Brand Name: Hiner-pack
Certification: ISO 9001 ROHS SGS
Model Number: HN23100
Payment & Shipping Terms:
Minimum Order Quantity: 1000 pcs
Price: Prices are determined according to different incoterms and quantities
Packaging Details: 80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size:35*30*30cm
Delivery Time: 1~2 Weeks
Payment Terms: T/T
Supply Ability: 2000PCS/Day

High Precision Anti-Static ESD Tray Memory Integrated Circuit JEDEC IC Chip STM Tray

Description
Mold No.: HN23100 Cavity Size/mm: 35.3*35.3*2.16
Overall Size/mm: 322.6x135.9x12.19 Material: ABS PEI MPPO PPE
Matrix Quantity: 3X7=21PCS Incoterms: EXW,FOB,CIF,DDU,DDP
Tray Features: ESD Stackable Quality Assurance: Delivery Guarantee, Reliable Quality
Heat Resistant: High Temperature 270° Country Of Origin: SHENZHEN
Compatible Ic Sizes: 8mm, 12mm, 16mm, 24mm Selling Units: Single Item
Tray Weight: 0.170 Kg Capacity: 3X7=21PCS
Custom: Non-standard
Highlight:

Anti-Static JEDEC IC Chip Tray

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High Precision JEDEC IC Chip Tray

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Memory Integrated Circuit ESD Tray

High Precision Anti-Static ESD Memory Integrated Circuit JEDEC Ic Chip STM Tray

 

Anti-Static MPPO Standard Matrix Tray For PCB Modules Electronic Components

 

The advantage of JEDEC tray packaging is that it can protect the products from damage and contamination during transportation and storage.TRAY trays can effectively isolate and protect the products from friction and collision, and at the same time, it can also prevent the products from being affected by moisture, dust and other pollutants. In addition, JEDEC trays can be used to display products aesthetically and increase their value and competitiveness.

High Precision Anti-Static ESD Tray Memory Integrated Circuit JEDEC IC Chip STM Tray 0

 

JEDEC Tray Parameters

 

1. Materials: Trays are typically manufactured using anti-static materials (e.g., ESD plastic) to ensure that static damage to chips is prevented during transportation.
 

2. Size and Shape: JEDEC standards specify the specific size and shape of trays to ensure that trays from different manufacturers can be used interchangeably and are suitable for a variety of automated equipment.
 

3. Compatibility: The trays are designed to be compatible with devices in a variety of package types, making them more efficient in the production and testing process.
 

4. marking and labeling: according to the standard, the pallet will usually be marked and labeled, in order to facilitate the tracking and identification of the devices in the tray.

 

Mold No. HN23100
Cavity size/mm 35.3*35.3*2.16
Overall size/mm 322.6x135.9x12.19
Matrix quantity. 3X7=21PCS
Material ABS PEI MPPO PPE

 

High Precision Anti-Static ESD Tray Memory Integrated Circuit JEDEC IC Chip STM Tray 1

 

 

Application of JEDEC Tray

 

1. Semiconductor chips: widely used for bare chip (die) transportation, especially integrated circuits (IC) and other types of semiconductor devices.
 

2. electronic components: suitable for storage and transportation of all types of electronic components, such as sensors, power amplifiers, etc.
 

3. automated production lines: in automated assembly and test equipment, the standardized design of the JEDEC Tray enables the equipment to handle and place chips efficiently.
 

4. Packaging plants: For the transportation of raw materials in semiconductor packaging plants to ensure the safety of chips during the production process.
 

5. Electronics Manufacturing Services (EMS): In the electronics manufacturing process, JEDEC Tray is used to store and transport components, increasing production efficiency.
R&D Labs: During the R&D phase, JEDEC Tray is used to store and test newly developed semiconductor devices.

 

High Precision Anti-Static ESD Tray Memory Integrated Circuit JEDEC IC Chip STM Tray 2

Contact Details
Shenzhen Hiner Technology Co.,LTD

Contact Person: Ms. Rainbow Zhu

Tel: 86 15712074114

Fax: 86-0755-29960455

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