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JEDEC IC Tray Standard BGA 11.3*13.3mm High Temperature Tray With 3X7 21PCS Matrix Quantity

JEDEC IC Tray Standard BGA 11.3*13.3mm High Temperature Tray With 3X7 21PCS Matrix Quantity

Brand Name: Hiner-pack
Model Number: HN23066
MOQ: 1000 pcs
Price: Prices are determined according to different incoterms and quantities
Payment Terms: T/T
Supply Ability: 2000PCS/Day
Detail Information
Place of Origin:
Made In China
Certification:
ISO 9001 ROHS SGS
Mold No.:
HN23066
Cavity Size/mm:
11.3*13.3*1.17
Overall Dimension/mm:
322.6x135.9x12.19
Material:
PEI/MPPO
Matrix Quantity:
3X7=21PCS
Height:
12.19mm
Shaping Mode:
Plasitc Injection Mould
Flatness:
Less Than 0.76mm
Color:
Black(According To Customer Needs)
Peculiarity:
Permanent Antistatic
Temperature:
180°C For 2 Hours
Experience:
14 Years
Incoterms:
EXW,FOB,CIF,DDU,DDP
Clean Class:
General And Ultrasonic Cleaning
Ic Type:
BGA,QFP,QFN,LGA,PGA
Packaging Details:
80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size:35*30*30cm
Supply Ability:
2000PCS/Day
Highlight:

3X7 JEDEC IC Tray

,

21PCS JEDEC matrix trays

,

High Temperature JEDEC IC Tray

Product Description

Reflow Testing Available JEDEC IC Tray Standard With BGA11.3*13.3mm High Temperature Tray

Optimize handling for QFN, BGA, and custom modules with JEDEC trays built precisely to your product specs.

Application:

1. Electronics Manufacturing: Widely used in semiconductor manufacturing, assembly, and testing.


2. R&D: Storing and testing new products in laboratories and R&D environments.


3. Logistics: Used in supply chain management to securely transport electronic components. 


Features & Advantages:

1. Durability: The injection molded material has good durability and impact resistance to provide full protection during transportation.


2. Multi-purpose: Suitable for the storage of a wide range of electronic components, such as integrated circuits (ICs), sensors, modules, etc.


3. Lightweight design: Lightweight design facilitates handling and storage, improving logistics efficiency.


4. Improve reliability: Prevent static electricity from damaging chips and components, and ensure product quality. 


5. Reduces loss: Effectively protects components and reduces damage and waste during transportation and storage.


6. Simplify operation: Standardized pallet design facilitates quick identification and handling in production lines and warehouses. 


7. Strong compatibility: Suitable for various package types, reducing inventory diversity and simplifying management.

Technical Parameters:

Brand Hiner-pack Outline Line Size 322.6*135.9*12.19mm
Model HN23066 Cavity Size 11.3*13.3*1.17mm
Package Type IC Component Matrix QTY 3*7=21PCS
Material PE/MPPO Flatness MAX 0.76mm
Color Black Service Accept OEM, ODM
Resistance 1.0x10e4-1.0x10e11Ω Certificate ROHS


Materials commonly used for JEDEC trays include MPPO, PEI (polyetherimide), PES (polyether sulfone), and PPE. 

Below are the characteristics of these materials and their advantages:


1. MPPO 
- Characteristics: 

Excellent thermal stability and mechanical strength. Suitable for high-temperature environments.

- Advantages: 

High temperature resistance: suitable for use in high temperature conditions to prevent deformation.
Excellent electrical insulation: protects electronic components and reduces electrostatic damage.
Chemical stability: maintains stability in a wide range of chemical environments.


2. PEI (Polyetherimide)
- Characteristics: 

Very high thermal stability and excellent mechanical properties. Can be used at temperatures up to 200°C.

- Advantages: 

High heat resistance: suitable for high-temperature processing and storage environments.
Excellent electrical insulation properties: effectively protects sensitive electronic components.
Excellent chemical resistance: able to resist a wide range of chemicals.


3. PES (Polyether Sulfide)
- Characteristics:

Combines the advantages of PEI, but with better toughness and thermal fluidity during injection molding. Suitable for a wide range of industrial applications.

- Advantages:

Good heat resistance: maintains physical properties in high-temperature environments.
Chemical resistance: good resistance to a wide range of chemicals.
Excellent mechanical properties: provides additional protection during transportation and storage.
 

4. PPE 
- Characteristics:

Good thermal stability and excellent electrical insulation properties.
Higher rigidity and strength.

- Advantages:

Excellent electrical insulation: effectively prevents static damage and protects electronic components.
High temperature resistance: suitable for use in high temperature environments to prevent deformation.
Chemical resistance: able to resist a wide range of chemicals, suitable for different application scenarios.

JEDEC IC Tray Standard BGA 11.3*13.3mm High Temperature Tray With 3X7 21PCS Matrix Quantity 0

JEDEC IC Tray Standard BGA 11.3*13.3mm High Temperature Tray With 3X7 21PCS Matrix Quantity 1


Customer FAQ:

Question 1: How long does it take to open the mold?

 • Sample mold: 20-25 days.
 • Soft mold: 12-15 days.
 • Hard mold: 15-20 days.
 • Hard mold (>200T) 25-28 days.
 • Two-color production mold: 25-28 days.

 • It depends on the requirement and complexity.


Question 2: What services can we provide?

1.OEM/ODM service.
2. Professional mold design and production service.
3. Provide plastic parts assembly service.
4. Provide plastic parts packaging service.
5. Provide after-sales service.


Question 3: How many kinds of plastic injection products do you produce?

Mainly for consumer electronics, medical facilities, auto parts, digital electronics, computer accessories, semiconductors, labor protection, and other products.

Welcome to the enquiry.

JEDEC IC Tray Standard BGA 11.3*13.3mm High Temperature Tray With 3X7 21PCS Matrix Quantity 2