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Stackable BGA Black Jedec IC Trays Conform To Automation Equipment

Stackable BGA Black Jedec IC Trays Conform To Automation Equipment

Brand Name: Hiner-pack
Model Number: HN23076
MOQ: 1000 pcs
Price: TBC
Payment Terms: 100% Prepayment
Supply Ability: 2000PCS/Day
Detail Information
Place of Origin:
shenzhen,China
Certification:
ISO 9001 SGS ROHS
Mold No.:
HN23076
Cavity Size/mm:
18.4*36.4*3.3
Overall Size/mm:
322.6x135.9x7.62
Matrix Quantity:
12X3=36PCS
Application:
IC Chip Packaging
Color:
Customer'requirement
Surface Resistance:
1.0*10e4-1.0*10e11Ω
Tray Weight:
120~200g
Tray Shape:
Rectangular
IC Type:
BGA,QFP,QFN,LGA,PGA
Tray Features:
Stackable
Packaging Details:
80~100pcs/carton
Supply Ability:
2000PCS/Day
Highlight:

Black Jedec IC Trays

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Stackable Jedec IC Trays

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Automation Equipment Jedec IC Trays

Product Description

Stackable BGA Black Jedec IC Trays Conform To Automation Equipment

Product Description:

These rectangular trays are stackable, allowing you to save space and easily access your IC chips when needed. They are also lightweight, with a weight range of 120~200g, making them easy to handle and transport.
The Jedec IC Trays are made from durable materials that can withstand frequent use and handling. They are an ideal solution for storing IC chips in a safe and organized manner, ensuring that your components are always within reach when you need them.


These trays are also compatible with other storage solutions such as cardboard box trays and grid cable trays, making it easy to integrate them into your existing storage setup. With their versatile design and high-quality construction, the Jedec IC Trays are an essential component of any electronics workshop or storage facility.
 
Stackable BGA Black Jedec IC Trays Conform To Automation Equipment 0

 

Features:

  • Product Name: Jedec IC Trays
  • Surface Resistance: 1.0*10e4-1.0*10e11Ω
  • Color: Black
  • Tray Weight: 120~200g
  • Material: MPPO.PPE.ABS.PEI.IDP
  • Tray Shape: Rectangular
  • Used for Grid Cable Tray, Core Tray Racking, Cardboard Box Trays
 

Technical Parameters:

Technical Parameter Value
Tray Features Stackable
IC Type BGA, QFP, QFN, LGA, PGA
Size 322.6*135.9mm
Tray Weight 120~200g
Surface Resistance 1.0*10e4-1.0*10e11Ω
Material MPPO.PPE.ABS.PEI.IDP
Color Black
Tray Shape Rectangular
Height 7.62mm
Application IC Packaging

 
 

Stackable BGA Black Jedec IC Trays Conform To Automation Equipment 1

 
Stackable BGA Black Jedec IC Trays Conform To Automation Equipment 2

Customization:

1. Product Customization Services for the Jedec IC Trays:
2. Brand Name: Hiner-pack
3. Model Number: JEDEC TRAY SERIES
4. Place of Origin: China
5. Certification: ISO 9001 SGS ROHS
6. Minimum Order Quantity: 500
7. Price: TBC
8. Packaging Details: 80~100pcs/carton in Cardboard Box Trays
9. Delivery Time: 1~2 Weeks
10. Payment Terms: 100% Prepayment
11. Supply Ability: 2000PCS/Day
12. IC Type: BGA,QFP,QFN,LGA,PGA
13. Color: Black
14. Tray Weight: 120~200g
15. Material: MPPO.PPE.ABS.PEI.IDP
16. Size: 322.6*135.9mm
17. Suitable for Electronic Components ICs
18. Can be used as Grid Cable Tray

 

FAQ:

Q: What is the brand name of the IC Trays?
A: The brand name of the IC Trays is Hiner-pack.
Q: What is the model number of the IC Trays?
A: The model number of the IC Trays is JEDEC TRAY SERIES.
Q: What is the certification of the IC Trays?
A: The IC Trays are certified with ISO 9001 SGS ROHS.
Q: What is the minimum order quantity for the IC Trays?
A: The minimum order quantity for the IC Trays is 500.
Q: What is the delivery time for the IC Trays?
A: The delivery time for the IC Trays is 1~2 weeks.