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Small Tray For IC Chip Handling Across Packaging And Inspection

Brand Name:	Hiner-pack
Model Number:	HN24035
MOQ:	1000 Pcs
Price:	$0.35~$0.85(Prices Are Determined According To Different Incoterms And Quantities）
Payment Terms:	T/T
Supply Ability:	4000PCS~5000PCS/per Day

Detail Information

Product Description

Detail Information

Certification:

ISO 9001 ROHS SGS

Color:

Black (Customizable)

Size:

2-inch (4-inch Optional)

Surface Resistance:

1.0x10E4~1.0x10E11Ω

Clean Class:

General And Ultrasonic Cleaning

Capacity:

11*8=88PCS

Warpage:

＜0.2mm

Custom Logo:

Available

Packaging Details:

It Depends On The QTY Of Order And Size Of Product

Supply Ability:

4000PCS~5000PCS/per Day

Product Description

Small Tray For IC Chip Handling Across Packaging And Inspection

The Bare Die Tray (Chip Tray & Waffle Pack) series from Hiner-pack provides a secure and convenient solution for packaging and transporting Chip, Die, COG, Optoelectronic devices, and other microelectronic components. The series offers products in various sizes and materials, ensuring flexibility to meet diverse needs. The product specifications include options for 2 inches and 4 inches in size.

The materials used for these trays include Antistatic/Conductive ABS and PC, which are known for their durability and protective properties. Customers can also request customized solutions tailored to their specific requirements, ensuring that the packaging meets their unique needs with precision and efficiency.

Features:

Molded of ESD-safe, non-sloughing, carbon-powder-free, clean polymers;
Carbon-fiber reinforced for strength and permanent ESD protection;
Up to 180°C bake temperature available;
Industry-standard formats, customized for your needs.

Technical Parameters:

HN24035 Technical Data Ref.
Base Information	Material	Color	Matrix QTY	Pocket Size
	ABS	Black	11*8=88PCS	4.203.001.30mm
Size	Length * Width * Height (according to customer's requirement)
Feature	Durable; Reusable; Rcofriendly; Biodegradable
Sample	A. The free samples: Choosen from existing products.
	B. Customized samples as per your design/demand
Accessory	Cover/Lid, Clip/Clamp, Tyvek paper
Artowrk Format	PDF,2D,3D

Specifications:

The external dimensions of waffle pack chip trays are standard: 2-inch trays are two inches square, 4-inch trays are four inches square, and so on. The variability lies in the pocket size, geometry, and count.

Waffle pack trays are typically defined by several characteristics:

External size – 2”, 4”, etc.
Pocket size or pocket count – selecting one will determine the other
Temperature rating – the highest temperature at which the tray can be utilized

For custom waffle pack trays, additional specifications are required:

Component geometry
Special process requirements
Quantity of trays needed or quantity of components to be processed (which helps in selecting the appropriate manufacturing process for tray production)

Tags:

Jedec IC Trays

Jedec Matrix Trays

IC Chip Tray

Custom Jedec Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

Jedec IC Trays

Jedec Matrix Trays

IC Chip Tray

Custom Jedec Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

Small Tray For IC Chip Handling Across Packaging And Inspection

Small Tray For IC Chip Handling Across Packaging And Inspection

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