Anti-Static JEDEC Tray Stackable Secure Handling For BGA PGA QFP

Anti-Static JEDEC Tray Stackable Secure Handling For BGA PGA QFP 

Looking for chip trays that actually fit your product? We customize every JEDEC tray cavity to match your device perfectly.

Developed to cater to the needs of precision-driven electronic manufacturing, this JEDEC matrix tray is designed to ensure the secure and static-safe handling of components during both automated and manual workflows. The tray is constructed using ESD-safe polymer material, and its pocket layout is precision-formed to provide excellent dimensional stability and protection.

Specifically engineered for environments that demand high-throughput performance, the tray is equipped with alignment features and a consistent surface design that allows for seamless integration with robotic arms, vacuum tools, and tray elevators. Whether the tray is used for component assembly, functional testing, or storage purposes, it guarantees the integrity of the products being handled at all stages of the process.

Features:

JEDEC-Standard Footprint: Enables effortless integration into tray handlers, feeders, conveyors, and storage systems across global manufacturing setups.

Static-Safe Design: Permanently conductive material prevents the accumulation of static charges, providing reliable protection for sensitive parts.

Precision Pocket Arrangement: Uniform pocket layout ensures exact positioning for accurate pick-up, reducing misalignment and potential handling damage.

Automation-Compatible: Chamfered corners and pickup zones allow for fast and secure robotic handling in automated lines.

Stacking Confidence: Built-in interlocks ensure trays stay aligned during vertical stacking, minimizing the chance of tray shifting or tipping.

 Long-Term Durability: Withstands operational demands including multiple handling cycles and controlled temperature variations without warping or cracking.

Technical Parameters:

Applications:

The matrix tray presented here is designed specifically to facilitate the precise management of semiconductors, hybrid circuits, MEMS devices, as well as other small components. It finds frequent application in the operation of rapid and automated assembly lines, IC testing facilities, setups for component programming, and the concluding stages of packing processes.

This versatile tray's ability to seamlessly integrate with standardized equipment further enhances its utility within logistics systems. It is well-suited for the safe transport of sensitive devices across different sites and their extended storage in warehouses.

Customization:

To match evolving manufacturing needs and unique component profiles, the tray supports a range of customization options:

• Custom Pocket Configurations: Tailor pocket shapes, depths, and spacing to accommodate components with non-standard or fragile profiles.

• Color-Coded Options: ESD-safe tray materials can be produced in distinct colors to support visual management strategies or part classification.

• Integrated Molded Identifiers: Add permanent batch numbers, customer logos, or part codes for easy identification and internal tracking.

• Tailored Mechanical Features: Include guide slots, extended tabs, or special locator elements to enhance compatibility with proprietary automation systems.