Injection Moulding JEDEC IC Trays Rectangular With High Temperature Resistance

Injection Moulding JEDEC IC Trays With High Temperature Resistance

Whether for BGA, PGA, QFP or proprietary modules, our JEDEC trays ensure consistent alignment and secure chip retention.

Developed for Precision-Driven Electronic Manufacturing : 
This JEDEC matrix tray is designed to provide secure and static-safe handling of components in both automated and manual workflows. Its construction using ESD-safe polymer and precision-formed pocket layout ensures excellent dimensional stability and protection.

High-Throughput Performance in Any Environment :
Perfect for environments that demand high-speed performance, this tray features alignment capabilities and a consistent surface design that allow seamless integration with robotic arms, vacuum tools, and tray elevators. Whether utilized in component assembly, functional testing, or storage, this tray guarantees product integrity at every stage.

Features:

JEDEC-Standard Footprint: The product features a JEDEC-standard footprint, making it easy to integrate into tray handlers, feeders, conveyors, and storage systems used in manufacturing worldwide.

Static-Safe Design: The use of permanently conductive materials in the design prevents the build-up of static charges, offering dependable protection for delicate components.

Precision Pocket Arrangement: An even pocket layout ensures precise positioning for accurate pick-up, reducing the risk of misalignment and potential damage during handling.

Automation-Compatible: The chamfered corners and pickup zones of the product are designed for quick and secure robotic handling in automated production lines.

Stacking Confidence: Integrated interlocks within the product support tray alignment during vertical stacking, minimizing the possibility of shifting or tipping.

Long-Term Durability:  The product is engineered to withstand the rigorous demands of multiple handling cycles and controlled temperature changes over time, maintaining its structural integrity without warping or cracking.

Technical Parameters:

Applications:

This matrix tray is perfect for the precise management of semiconductors, hybrid circuits, MEMS devices, and other small components. It is frequently utilized in fast-paced automated assembly lines, IC testing stations, component programming configurations, and the final stages of packaging. Due to its compatibility with standardized equipment, it is also valuable in logistics systems for the transportation between sites and for the long-term storage of delicate devices.

Customization:

To match evolving manufacturing needs and unique component profiles, the tray supports a range of customization options:

• Custom Pocket Configurations: Tailor pocket shapes, depths, and spacing to accommodate components with non-standard or fragile profiles.

• Color-Coded Options: ESD-safe tray materials can be produced in distinct colors to support visual management strategies or part classification.

• Integrated Molded Identifiers: Add permanent batch numbers, customer logos, or part codes for easy identification and internal tracking.

• Tailored Mechanical Features: Include guide slots, extended tabs, or special locator elements to enhance compatibility with proprietary automation systems.