Warpage Less Than 0.76mm Black Electronic Components IC Chips Trays For Consistent Performance

Warpage Less Than 0.76mm Black Electronic Components IC Chips For Consistent Performance

Stackable, durable, and dimensionally accurate—our JEDEC trays are the packaging products trusted by global IC manufacturers.

Developed to cater to the needs of precision-driven electronic manufacturing, this JEDEC matrix tray is designed to provide secure, static-safe handling of components during both automated and manual workflows. The tray is constructed with ESD-safe polymer material to ensure the safety of components and boasts a precision-formed pocket layout that offers exceptional dimensional stability and protection.

Perfect for environments that demand high-throughput performance, this tray is equipped with alignment features and a consistent surface design that allows for seamless integration with robotic arms, vacuum tools, and tray elevators. Whether employed in component assembly, functional testing, or storage, it guarantees product integrity at each stage of the process.

Features:

Utilizing a JEDEC-standard footprint makes integration into tray handlers, feeders, conveyors, and storage systems seamless across various manufacturing facilities worldwide.

The use of permanently conductive material prevents static charge buildup, ensuring a reliable shield for delicate components.

By adopting a uniform pocket layout, exact positioning is achieved for precise pick-up, substantially reducing misalignments and the risk of handling-related damages.

Facilitating fast and secure robotic handling in automated production lines, chamfered corners and pickup zones are designed for compatibility with automation systems.

Incorporating built-in interlocks guarantees tray alignment during vertical stacking, effectively decreasing the likelihood of shifting or tipping.

The tray is engineered to withstand rigorous operational demands, enduring multiple handling cycles and controlled temperature variations without warping or cracking.

Technical Parameters:

Applications:

This matrix tray is designed for the precise management of semiconductors, hybrid circuits, MEMS devices, and other compact components. It is extensively used in high-speed automated assembly lines, IC testing stations, component programming configurations, and final packing operations.

The tray's compatibility with standardized equipment facilitates its integration into logistics systems for seamless cross-site transportation and extended storage of delicate devices.

Customization:

To match evolving manufacturing needs and unique component profiles, the tray supports a range of customization options:

• Custom Pocket Configurations: Tailor pocket shapes, depths, and spacing to accommodate components with non-standard or fragile profiles.

• Color-Coded Options: ESD-safe tray materials can be produced in distinct colors to support visual management strategies or part classification.

• Integrated Molded Identifiers: Add permanent batch numbers, customer logos, or part codes for easy identification and internal tracking.

• Tailored Mechanical Features: Include guide slots, extended tabs, or special locator elements to enhance compatibility with proprietary automation systems.