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Surface Resistance 1.0*10e4-1.0*10e11Ω 322.6*135.9*7.62 JEDEC IC Trays

Surface Resistance 1.0*10e4-1.0*10e11Ω 322.6*135.9*7.62 JEDEC IC Trays

Brand Name: Hiner-pack
Model Number: JEDEC TRAY SERIES
MOQ: 500 PCS
Price: OTM
Payment Terms: 100% Prepayment
Supply Ability: 2000-3000PCS/Day
Detail Information
Place of Origin:
Shenzhen,China
Certification:
ISO9001, SGS, ROHS
Experience:
12 Years
Surface Resistance:
1.0*10e4-1.0*10e11Ω
Packing Level:
Transport Package
Capacity:
Varies Depending On IC Size
Quality Assurance:
Delivery Guarantee, Reliable Quality
Flatness:
<0.76mm
Color:
Black
Application:
IC Packaging
Packaging Details:
Carton packaging
Supply Ability:
2000-3000PCS/Day
Highlight:

JEDEC IC trays with surface resistance

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high resistance JEDEC IC trays

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322.6x135.9x7.62mm JEDEC IC trays

Product Description

Product Description:

    The JEDEC IC Trays product is an essential component for the safe and organized storage and transportation of integrated circuits (ICs). Designed in a sleek black color, these trays are not only visually appealing but also highly functional in protecting and organizing ICs of various sizes.With a capacity that varies depending on the size of the ICs, these trays are versatile and adaptable to different needs and requirements. Whether you are storing small, medium, or large ICs, the JEDEC IC Trays can accommodate them all efficiently.One of the key features of these trays is their surface resistance, which ranges from 1.0*10e4 to 1.0*10e11Ω. This ensures that the ICs stored in the trays are well-protected from static electricity and other potential risks that could affect their functionality and performance.

Features:

  • Product Name: JEDEC IC Trays
  • Surface Resistance: 1.0*10e4-1.0*10e11Ω
  • Flatness: <0.76mm
  • Processing: Injection
  • Matrix Quantity: 5*13=65PCS
  • Application: IC Packaging

Applications:

I. Chip Reliability Testing:

JEDEC Trays are used for reliability testing of semiconductor chips such as High Temperature Operating Life (HTOL) and Temperature Cycling (TC). Their high-temperature resistant materials can directly carry chips into the test chamber.

 

 

II. Temporary Storage Management after Wafer Dicing:

In the wafer dicing process, JEDEC Trays serve as temporary storage carriers for bare chips, cooperating with UV film peeling equipment to realize automatic chip sorting.


Customization:

Brand Name: Hiner-pack

Minimum Order Quantity: 500 PCS

Delivery Time: 1~2 Weeks

Payment Terms: 100% Prepayment

Surface Resistance: 1.0*10e4-1.0*10e11Ω

Packing Level: Transport Package

Flatness: <0.76mm

Capacity: Varies Depending On IC Size


Packing and Shipping:

    Our JEDEC IC Trays are carefully packaged to ensure they arrive safely to you. Each tray is sealed in a protective plastic cover, and then placed in a sturdy cardboard box for additional protection during shipping.

For shipping, we use a trusted courier service to deliver your order promptly and securely. Your JEDEC IC Trays will be handled with care to prevent any damage during transit.