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High Temperature JEDEC Tray Secure And Stackable IC Tray Design For Bake Oven

Brand Name:	Hiner-pack
Model Number:	HN24140
MOQ:	500pcs
Price:	$1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
Payment Terms:	100% Prepayment
Supply Ability:	2000PCS/Day

Detail Information

Product Description

Detail Information

Place of Origin:

SHENZHEN CHINA

Certification:

RoHS、ISO

Surface Resistance:

1.0x10E4~1.0x10E11Ω

Property:

ESD, Non-ESD

Warpage:

Less Than 0.76mm

Color:

Black, Red, Yellow, Green, White, Etc.

Certificate:

RoHS, IOS

Customized Service:

Support Standard And Non-standard

Material:

MPPO

Packaging Details:

70~100pcs/carton(According To The Customer Demand）

Supply Ability:

2000PCS/Day

Product Description

Product Description:

This ESD-Safe JEDEC Tray is specifically designed for the protection and handling of semiconductor devices across automated manufacturing lines. Built from high-performance conductive polymer, it ensures stable electrostatic control while maintaining precise pocket geometry for secure part retention. Its rigid structure and uniform layout provide reliable compatibility with robotic arms, pick-and-place systems, and tray elevators, making it an ideal solution for high-volume, precision-driven production environments.

Features & Benefits:

JEDEC Standard Compliance – Fully meets JEDEC outline specifications to ensure interchangeability with global handling and packaging systems.

Excellent ESD Protection – Conductive material effectively dissipates static charges, protecting sensitive components during every stage of handling.

Precision-Molded Pockets – Consistent pocket design minimizes component movement, ensuring accurate placement during transport or inspection.

Automation Adaptability – Compatible with robotic sorting systems and tray stackers to streamline automated workflows.

Reinforced Frame Design – Strengthened edges reduce flexing and warping, maintaining dimensional accuracy through repeated cycles.

Stacking Efficiency – Interlocking edges enable stable vertical stacking, simplifying storage and transport logistics.

Technical Parameters:

Brand	Hiner-pack
Model	HN24140
Material	MPPO
Package Type	IC Component
Color	Black
Resistance	1.0x10e4-1.0x10e11Ω
Outline Line Size	322.6x135.9x7.62mm
Cavity Size	5.06.41.03mm
Matrix QTY	11*28=308PCS
Flatness	MAX 0.76mm
Service	Accept OEM, ODM
Certificate	RoHS, IOS

Applications:

Widely applied in semiconductor manufacturing, IC assembly, module testing, and device transportation, this tray provides consistent performance under both cleanroom and standard production conditions. It ensures efficient handling of small chips, logic devices, and analog components while reducing risks of electrostatic discharge and physical damage. Its compatibility with automated systems allows manufacturers to optimize production throughput and maintain process stability.

Customization:

This tray can be modified to accommodate unique device specifications or process needs:

Custom Pocket Geometry – Designed for chips, modules, or special-shaped components requiring non-standard cavity profiles.

Color Options – ESD-safe materials can be customized in various colors for product or batch distinction.

Permanent Marking Options – Incorporate molded batch codes, serial numbers, or customer logos for traceability.

Automation Interface Options – Optional indexing holes, tabs, or side cutouts for enhanced robotic or conveyor integration.

Tags:

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

High Temperature JEDEC Tray Secure And Stackable IC Tray Design For Bake Oven

High Temperature JEDEC Tray Secure And Stackable IC Tray Design For Bake Oven

Product Description:

Features & Benefits:

Technical Parameters:

Applications:

Customization:

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