Products

Home / Products / JEDEC Matrix Trays /

Precision JEDEC IC Trays Tailored For IC Chip Production In Semiconductor

Brand Name:	Hiner-pack
Model Number:	HN24139
MOQ:	500pcs
Price:	$1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
Payment Terms:	100% Prepayment
Supply Ability:	2000PCS/Day

Detail Information

Product Description

Detail Information

Place of Origin:

SHENZHEN CHINA

Certification:

RoHS、ISO

Molding Method:

Injection Moulding

Temperature:

80°C~180°C

Warpage:

Less Than 0.76mm

Durable:

Yes

Customized Service:

Support Standard And Non-standard

Property:

ESD, Non-ESD

Stackable:

Yes

Anti-Static:

Yes

Packaging Details:

70~100pcs/carton(According To The Customer Demand）

Supply Ability:

2000PCS/Day

Product Description

Product Description:

The High Precision JEDEC Matrix Tray is engineered to deliver exceptional dimensional accuracy and stability for semiconductor packaging and component handling. Designed to meet JEDEC global standards, it offers a reliable solution for transporting, testing, and storing delicate devices within automated environments. Each pocket maintains precise geometry, ensuring components stay aligned and protected during multi-step production flows. The tray’s ESD-safe material provides consistent anti-static performance while withstanding long-term use in cleanroom and production settings.

Features & Benefits:

High Dimensional Accuracy – Maintains tight tolerances across all pockets, ensuring reliable component positioning in high-speed automation.

Global JEDEC Compatibility – Fully compliant with JEDEC standards for smooth interchangeability across equipment and supply chains.

Static Dissipative Performance – Stable ESD protection prevents electrostatic damage to sensitive devices.

Smooth Pocket Surface – Minimizes friction and particle generation during automated loading and unloading.

Structural Integrity – Reinforced frame enhances tray rigidity and prevents warping under operational stress.

Stackable Design – Interlocking edges allow secure stacking for compact storage and efficient logistics.

Technical Parameters:

Brand	Hiner-pack
Model	HN24139
Material	MPPO
Package Type	IC Component
Color	Black
Resistance	1.0x10e4-1.0x10e11Ω
Outline Line Size	322.6x135.9x12.19mm
Cavity Size	30.4x15.5x7.65mm
Matrix QTY	6*8=48PCS
Flatness	MAX 0.76mm
Service	Accept OEM, ODM
Certificate	RoHS, IOS

Applications:

This tray is designed for high-precision manufacturing environments requiring consistent alignment and handling of small to medium-sized components. Typical uses include IC assembly, semiconductor module packaging, high-reliability testing, and device storage. It performs effectively under robotic transfer systems, pick-and-place machinery, and automated conveyors, supporting stable operation in cleanroom or standard production conditions.

Customization:

The High Precision JEDEC Matrix Tray can be customized for unique production demands and specialized device geometries:

Tailored Pocket Designs – Adjust pocket shape and depth to suit varied device outlines or thicknesses.

Color Customization – Available in multiple ESD-safe color variants to support line management and batch identification.

Integrated Identification – Include molded markings or embedded codes for traceability and process control.

Automation-Ready Enhancements – Optional edge and corner modifications ensure compatibility with proprietary automation interfaces or specialized robotic systems.

Tags:

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

Precision JEDEC IC Trays Tailored For IC Chip Production In Semiconductor

Precision JEDEC IC Trays Tailored For IC Chip Production In Semiconductor

Product Description:

Features & Benefits:

Technical Parameters:

Applications:

Customization:

ESD JEDEC Matrix Trays

SGS JEDEC Matrix Trays

SGS JEDEC Tray

Reused ESD Matrix Trays JEDEC IC Shipping Tray For Optical Device

SGS Plastic Black ESD JEDEC Matrix Trays For Electronic Products

PCB Module Packaging ESD JEDEC Matrix Trays 21PCS High Temperature Resistant

Anti Corrosive Black JEDEC Tray Suppliers Cycle Loading For Nano Sensor

PES Material ESD JEDEC Matrix Tray Warpage Less Than 0.76mm