Surface Resistance 1.0x10E4-1.0x10E11Ω JEDEC Matrix Trays for DDU Incoterms by and Injection Moulding

Product Description:

JEDEC (Joint Electronic Device Engineering Council – www.jedec.org ) creates open standards for the microelectronics industry, ensuring product interoperability, benefiting the industry and ultimately consumers by reducing product development time and costs while increasing efficiency and productivity.

JEDEC trays all are the same size, with a standardized outline, and required features. Putting parts in a JEDEC tray ensures that your parts can be processed in industry-standard automation equipment like pick and place machines, inspection, laser marking, testing, and dispensing equipment. Commercially available JEDEC tray feeders can be easily added to custom process machines. When you use JEDEC trays, you get an instant benefit from decades of experience and access to an installed base and continuing supply of automation tools.

The maximum baking temperature is stamped into JEDEC trays. Exceeding the stated maximum baking temperature will cause the dimensions of the tray to alter; thus, potentially damaging the contents. The type of molding compound used during the tray's manufacture determines the tray's maximum temperature rating. Multiple compounds and/or powders are mixed together during the molding process to add specific features such as color, ESD properties, dimensional stability and maximum temperature ratings.

Features:

In general, JEDEC trays are custom designed and manufactured. Many of them are not only device specific but device manufacturer specific. It’s not uncommon for two component sources’ parts to require different trays because of allowable variation in package sizing. Component footprint (for PCB layout) is more tightly controlled than packaging which varies greatly with packaging technology and material.

Off-the-shelf simply means a manufacturer has enough demand for a specific custom tray that they carry some inventory. More common is open-tooled where a custom mold will be set up and run for any order but often with a minimum quantity and/or significant setup charges.

Technical Parameters:

Applications:

Packaging: At their core, trays are simply containers. The JEDEC tray outline includes features for stacking, whereby each successive tray becomes the cover for the tray below.

Transportation & Storage: Parts loaded into stacked JEDEC trays are easy to store or transport, across the room or around the world. JEDEC trays also function as process “boats”, transporting their contents through a variety of process tools and equipment.

Protection: JEDEC trays protect the parts they hold from mechanical damage. Most JEDEC trays are manufactured using materials that also provide electrical protection from electrostatic discharge (ESD) damage.

Standardization: JEDEC IC matrix trays offer compatibility with most semiconductor and PC board manufacturing equipment. With decades of history and familiarity, support products for JEDEC trays are widespread and global. This includes corrugated boxes, protective covers, retaining straPET, modular feeders, and a wealth of industry knowledge.

Customization:

Product Customization Services for JEDEC Matrix Trays:

Brand Name: Hiner-pack

Model Number: HN 24107

Place Of Origin: China

Certification: RoHS、ISO

Minimum Order Quantity: 500pcs

Price: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）

Packaging Details: 70~100pcs/carton(According To The Customer Demand）

Delivery Time: 1~2 Weeks

Payment Terms: 100% Prepayment

Supply Ability: 2000PCS/Day

Customized Service: Support Standard And Non-standard

Warpage: Less Than 0.76mm

Place of Origin: SHENZHEN CHINA

Molding Method: Injection Moulding

Durable: Yes