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JEDEC IC Trays

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Home / Products / Waffle Pack Chip Trays /

Automation-Ready 4-inch ESD Safe Waffle Pack Tray For IC Handling And Robotic Assembly

Automation-Ready 4-inch ESD Safe Waffle Pack Tray For IC Handling And Robotic Assembly

Automation-Ready 4-inch ESD Safe Waffle Pack Tray For IC Handling And Robotic Assembly

Brand Name: Hiner-pack
Model Number: HN25151
MOQ: 500pcs
Price: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
Payment Terms: 100% Prepayment
Supply Ability: 2000PCS/Day
Detail Information
Product Description
Detail Information
Place of Origin:
China
Certification:
RoHS、ISO
Matrix:
10x13＝130PCS
Humidity Resistance:
Up To 90%
Cavity Size:
6.95x4.7x1.45mm
Weight Capacity:
Varies, Typically Up To 500 Grams Per Cavity
Uv Resistance:
Yes
Warpage:
Less Than 0.76mm
Reusability:
Yes
Application:
IC Handling, Storage, And Shipping
Packaging Details:
70~100pcs/carton(According To The Customer Demand）
Supply Ability:
2000PCS/Day
Highlight:

4-inch Waffle Pack Tray

,

Automation-Ready IC Tray

,

ESD Safe Automation Tray

Product Description
Automation-Ready 4-inch Waffle Pack Tray
Designed for robotic and automated lines, this 4-inch waffle pack tray offers stable IC positioning and compatibility with pick-and-place systems.
Key Features/ Benefits
  • Robot-friendly design
  • Standard 4-inch format
  • Stackable
  • ESD safe
Specifications
BrandHiner-pack
ModelHN25151
MaterialAnti-static composite plastic
Tray TypeWaffle automation tray
ColorBlack
Surface Resistivity1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size101.6x101.6x5.1 mm
Pocket Size6.95x4.7x1.45mm
Matrix QTY10x13＝130PCS
WarpageMAX 0.76mm
ServiceAccept OEM, ODM
CertificationsRoHS, ISO
Applications
  • Robotic assembly
  • Automated conveyors
  • IC line integration

Customization:

The tray’s flexible design supports a wide range of customized configurations to meet specific production challenges: 

•  Tailored Pocket Layouts: Adjust pocket size, count, or spacing to match non-standard part dimensions or shapes.  

•  Color Coding Options: Use ESD-safe materials in selected colors for identifying product types, workstations, or production phases.  

•  In-Mold Marking: Add customer-specific identifiers or tracking features during manufacturing for clear and permanent identification.  

•  Specialized Alignment Features: Modify edges or add tool-specific indexing tabs to optimize performance in proprietary handling systems.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Factory-direct manufacturer of JEDEC & IC trays
  • JEDEC compliant, automation-compatible designs
  • OEM & ODM customization supported
  • Consistent quality and stable supply
  • Trusted by global semiconductor customers
Tags: 

ABS waffle pack trays  

ABS Waffle Pack Chip Trays  

Waffle Pack Chip Trays

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