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BGA CSP JEDEC IC Tray with V-Groove Protection, High Precision Cavity, and ESD-Safe MPPO Material

Name: BGA CSP JEDEC IC Tray with V-Groove Protection, High Precision Cavity, and ESD-Safe MPPO Material
Brand: Shenzhen Hiner Technology Co., Ltd.
SKU: HN24234
Price: 1.35 USD
Availability: InStock

Brand Name:	Hiner-pack
Model Number:	HN24234
MOQ:	500 pcs
Price:	$1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
Payment Terms:	T/T
Supply Ability:	2000PCS/Day

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

ROHS, ISO

Tray Weight:

Varies, Typically Up To 500 Grams Per Cavity

Color:

Usually Black Or Dark Gray For ESD Protection

Quality Assurance:

Delivery Guarantee, Reliable Quality

Cavity Size:

17x10.5x5.17 Mm

Incoterms:

EXW, FOB, CIF, DDU, DDP

Mold Type:

Injection

Reusable:

Yes

Tray Shape:

Rectangular

Clean Class:

General And Ultrasonic Cleaning

Ic Type:

BGA,QFP,QFN,LGA,PGA

Packing Level:

Transport Package

Flatness:

Less Than 0.76mm

Capacity:

8x13=104 PCS

Packaging Details:

CARTON, PALLET

Supply Ability:

2000PCS/Day

Highlight:

BGA JEDEC tray with V groove

CSP IC tray for precision protection

JEDEC IC tray with V groove

Product Description

BGA CSP JEDEC Tray with V Groove for Precision IC Protection

Designed for high-level semiconductor cleanroom environments, this tray minimizes contamination and ensures IC integrity.

Key Features/ Benefits

V-groove protection design
Reduced chip damage
Suitable for fine pitch IC
High precision cavity

Specifications

Brand		Hiner-pack
Model		HN24234
Material		MPPO
Package Type		JEDEC
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		322.6×135.9×12.19 mm
Cavity Size		17x10.5x5.17 mm
Matrix QTY		8x13=104 PCS
Warpage		MAX 0.76mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

JEDEC trays are widely used for IC protection during manufacturing and transport, especially for ESD-sensitive devices

BGA
CSP
Fine pitch IC

Packaging & Shipping/ Services

JEDEC Matrix Trays are packaged in durable, anti-static materials with secure stacking and cushioning inserts. Customized packaging solutions are available upon request. All shipments are tracked and handled by trusted carriers for reliable worldwide delivery.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / waffle pack trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

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Address

Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN

Tel

86-0755-23229236-816

E-mail

Rainbowzhu@hiner-pack.com

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BGA CSP JEDEC IC Tray with V-Groove Protection, High Precision Cavity, and ESD-Safe MPPO Material

BGA CSP JEDEC IC Tray with V-Groove Protection, High Precision Cavity, and ESD-Safe MPPO Material

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