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High-precision JEDEC trays protect ICs from contamination and damage

High-precision JEDEC trays protect ICs from contamination and damage

Brand Name: Hiner-pack
Model Number: HN24234
MOQ: 500 pcs
Price: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
Payment Terms: T/T
Supply Ability: 2000PCS/Day
Detail Information
Place of Origin:
China
Certification:
ROHS, ISO
Tray Weight:
Varies, Typically Up To 500 Grams Per Cavity
Color:
Usually Black Or Dark Gray For ESD Protection
Quality Assurance:
Delivery Guarantee, Reliable Quality
Cavity Size:
17x10.5x5.17 Mm
Incoterms:
EXW, FOB, CIF, DDU, DDP
Mold Type:
Injection
Reusable:
Yes
Tray Shape:
Rectangular
Clean Class:
General And Ultrasonic Cleaning
Ic Type:
BGA,QFP,QFN,LGA,PGA
Packing Level:
Transport Package
Flatness:
Less Than 0.76mm
Capacity:
8x13=104 PCS
Packaging Details:
CARTON, PALLET
Supply Ability:
2000PCS/Day
Highlight:

BGA JEDEC tray with V groove

,

CSP IC tray for precision protection

,

JEDEC IC tray with V groove

Product Description
High-precision JEDEC trays protect ICs from contamination and damage
Designed for high-level semiconductor cleanroom environments, these JEDEC trays are engineered to meet strict contamination control requirements, minimizing particle buildup and ensuring full IC integrity from production to delivery. 

Built with high-precision cavities and a secure V-groove structure, they prevent chip movement, scratches, and mechanical damage, even during high-volume manufacturing, handling, and long-distance transport.

Ideal for fine-pitch ICs, BGA, and CSP packages, these trays deliver reliable protection, reduce yield loss risks, and support consistent quality in sensitive semiconductor applications.
Key Features/ Benefits 
  • Anti-static
  • ESD-safe
  • Contamination-free
  • Low-particle
  • High-precision 
Specifications
Brand Hiner-pack
Model  HN24234
Material  MPPO
Package Type JEDEC
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 322.6×135.9×12.19 mm
Cavity Size 17x10.5x5.17 mm
Matrix QTY 8x13=104 PCS
Warpage MAX 0.76mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
JEDEC trays are widely used for IC protection during manufacturing and transport, especially for ESD-sensitive devices.They are especially suitable for handling and storing ESD-sensitive components, where even minor particle buildup or scratches can impact device performance and yield.
  • Semiconductor manufacturing & assembly 
  • BGA / CSP packages
  • Fine pitch IC
  • Safe component transport and storage
Packaging & Shipping/ Services
Our JEDEC matrix trays are carefully packaged to ensure they arrive in perfect condition, ready for use in your cleanroom and production environments. Each set is securely wrapped in durable, anti-static materials, with protective stacking layers and cushioning inserts to prevent scratches, contamination, and damage during transit.

For global delivery, we work with trusted logistics partners to provide reliable, tracked shipping services worldwide. Whether you need standard lead-time delivery or expedited shipments, we ensure your order is handled with care and delivered on schedule, so you can keep your production lines running without delays.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers