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Cleanroom-Grade Waffle Pack Chip Trays for IC Handling Contamination Control

Brand Name:	Hiner-pack
Model Number:	HN24132
MOQ:	500 pcs
Price:	$1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
Payment Terms:	T/T
Supply Ability:	2000PCS/Day

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

ROHS, ISO

Tray Weight:

Varies, Typically Up To 500 Grams Per Cavity

Color:

Usually Black Or Dark Gray For ESD Protection

Quality Assurance:

Delivery Guarantee, Reliable Quality

Cavity Size:

5.0x3.35x1.20 Mm

Incoterms:

EXW, FOB, CIF, DDU, DDP

Mold Type:

Injection

Reusable:

Yes

Tray Shape:

Rectangular

Clean Class:

General And Ultrasonic Cleaning

Ic Type:

BGA,QFP,QFN,LGA,PGA

Packing Level:

Transport Package

Warpage:

Warpage MAX 0.3mm

Capacity:

9x7=63 PCS

Packaging Details:

CARTON, PALLET

Supply Ability:

2000PCS/Day

Product Description

Cleanroom-Grade Waffle Pack Chip Trays for IC Handling Contamination Control

Cleanroom-Grade Waffle Pack Chip Trays meet strict cleanroom industry standards. Trays provide professional contamination control performance, and offer safe stable handling for delicate fine pitch IC chips.

Cleanroom-Grade Waffle Pack Chip Trays adopt reliable JEDEC standard structure. Trays effectively avoid dust and pollution damage, and well protect precision semiconductor chips in manufacturing processes.

Cleanroom-Grade Waffle Pack Chip Trays deliver stable reliable chip carrier performance. Trays fit daily IC packaging, storage and transport work perfectly, keeping sensitive chips clean and intact.

Key Features/ Benefits

Support small batch production in the first batch.
Effective IC Contamination Control
Suitable for Delicate Fine Pitch ICs
More than 12 years of export experience.
Safe Stable Semiconductor Handling
The factory has ISO certification, and the products comply with the RoHS standard.

Specifications

Brand		Hiner-pack
Model		HN24132
Material		MPPO
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		50.7×50.7×7.4 mm
Cavity Size		5.0x3.35x1.20 mm
Matrix QTY		9x7=63 PCS
Warpage		MAX 0.2mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Cleanroom-Grade Waffle Pack Chip Trays provide full reliable IC protection during semiconductor manufacturing and transportation. Trays own excellent contamination control performance, and perfectly protect ESD-sensitive fine pitch chip devices.

Trays are widely used for fine pitch IC packaging (QFN, BGA, CSP), automated pick-and-place equipment, semiconductor inspection & testing work, as well as daily IC logistics and storage management.

Customized Services

Cleanroom-Grade Waffle Pack Chip Trays support fully customized cavity sizes and layout designs. Trays adopt cleanroom-grade dust-free anti-static material, with stable stacking structure to avoid contamination damage during transit.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / waffle pack trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

Tags:

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

Cleanroom-Grade Waffle Pack Chip Trays for IC Handling Contamination Control

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