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Cleanroom Waffle Pack IC Trays for Contamination Control & Secure Storage

Brand Name:	Hiner-pack
Model Number:	HN24150
MOQ:	500 pcs
Price:	$1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
Payment Terms:	T/T
Supply Ability:	2000PCS/Day

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

ROHS, ISO

Color:

Usually Black Or Dark Gray For ESD Protection

Quality Assurance:

Delivery Guarantee, Reliable Quality

Incoterms:

EXW, FOB, CIF, DDU, DDP

Mold Type:

Injection

Reusable:

Yes

Tray Shape:

Rectangular

Clean Class:

General And Ultrasonic Cleaning

Ic Type:

BGA,QFP,QFN,LGA,PGA

Packing Level:

Transport Package

Warpage:

Warpage MAX 0.2mm

Capacity:

18x12=216 PCS

Packaging Details:

CARTON, PALLET

Supply Ability:

2000PCS/Day

Product Description

Cleanroom Waffle Pack IC Trays for Contamination Control & Secure Storage

Cleanroom waffle pack IC trays adapts to strict semiconductor cleanroom production environments. Meets international cleanroom-grade standards, provides reliable contamination control performance for delicate fine pitch IC chips.

Adopts standardized JEDEC precise grid cavity structure. Prevents dust pollution damage effectively, maintains stable performance during daily chip storage, handling and transfer procedures.

Supports fully customized cavity layouts for diverse chip specifications. Owns excellent anti-static performance, perfectly matches semiconductor packaging, testing and logistics needs, offers long-lasting stable protection for high-value precision IC chips.

Key Features/ Benefits

Support small batch production in the first batch.
Effective IC Contamination Control
Suitable for Delicate Fine Pitch ICs
More than 12 years of export experience.
Safe Stable Semiconductor Handling
The factory has ISO certification, and the products comply with the RoHS standard.

Specifications

Brand		Hiner-pack
Model		HN24150
Material		MPPO
Color		Usually black or dark gray for ESD protection
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		50.7×50.7×7.4 mm
Matrix QTY		18x12=216 PCS
Warpage		MAX 0.2mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Cleanroom-grade waffle pack IC trays cover full semiconductor workflows, including manufacturing, packaging, inspection, testing, transportation and storage.

With top contamination control performance, trays protect ESD-sensitive fine pitch chips well. Trays adapt to QFN/BGA/CSP packaging, automated pick-and-place lines, semiconductor testing operations and daily IC logistics inventory management.

Customized Services

Waffle pack IC trays support fully customized cavity grid layouts and slot sizes. Custom designs match diverse fine pitch IC chip specifications. Customized dimension, material and JEDEC standard structures meet exclusive cleanroom production and handling demands for different semiconductor application scenarios.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / waffle pack trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

Tags:

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

Cleanroom Waffle Pack IC Trays for Contamination Control & Secure Storage

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