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Anti-Static High Temperature Cross-Slot Waffle Pack Trays for Semiconductor IC Chips

Brand Name:	Hiner-pack
Model Number:	HN24174
MOQ:	500 pcs
Price:	$1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）
Payment Terms:	T/T
Supply Ability:	2000PCS/Day

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

ROHS, ISO

Tray Weight:

Varies, Typically Up To 500 Grams Per Cavity

Color:

Black

Quality Assurance:

Delivery Guarantee, Reliable Quality

Outline Line Size:

50.8×50.8×3.94 Mm

Cavity Size:

6.49x3.86x0.67 Mm

Incoterms:

EXW, FOB, CIF, DDU, DDP

Mold Type:

Injection

Reusable:

Yes

Tray Shape:

Rectangular

Clean Class:

General And Ultrasonic Cleaning

Ic Type:

BGA,QFP,QFN,LGA,PGA

Packing Level:

Transport Package

Warpage:

Warpage MAX 0.2mm

Capacity:

5x7=35 PCS

Packaging Details:

CARTON, PALLET

Supply Ability:

2000PCS/Day

Product Description

Anti-Static High Temperature Cross-Slot Waffle Pack Trays for Semiconductor IC Chips

Deliver stable anti-static protection for IC chips. Withstand up to 125℃ high temperature. Adopt optimized cross-slot structure to lock components tightly. Keep chips safe from dust and contamination. Need reliable semiconductor chip carrying solutions?

Fit semiconductor encapsulation, chip testing, die sorting and wafer processing. Adapt to automated production lines and precision handling workflows. Work smoothly in cleanroom and workshop environments.

Support chip turnover, storage, logistics and vacuum packaging. Offer flexible cavity size, layout and material customization. Create exclusive cross-slot designs for various IC models to meet specific needs.

Key Features/ Benefits

Deliver effective ESD anti-static performance
Stable high-temperature resistance up to 125℃
Suitable for Delicate Fine Pitch ICs
Protects delicate fine pitch IC components efficiently
Support fully customized cavity sizes and layout designs
The factory has ISO certification, and the products comply with the RoHS standard.

Specifications

Brand		Hiner-pack
Model		HN24174
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		50.8×50.8×3.94 mm
Cavity Size		6.49x3.86x0.67 mm
Matrix QTY		5x7=35 PCS
Warpage		MAX 0.2mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Apply to semiconductor encapsulation, IC performance testing, die sorting and wafer fabrication. Adapt to high-precision electronic manufacturing and cleanroom operations.

Support chip internal turnover, long-term storage, logistics and vacuum packaging. Meet diversified integrated circuit processing and electronic assembly needs.

Customized Services

Accept personalized cross-slot customization. Offer flexible cavity size, layout and material upgrades. Create exclusive designs for diverse IC specifications. Provide one-stop tailored solutions for semiconductor packaging needs.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / waffle pack trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

Tags:

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

Anti-Static High Temperature Cross-Slot Waffle Pack Trays for Semiconductor IC Chips

Anti-Static High Temperature Cross-Slot Waffle Pack Trays for Semiconductor IC Chips

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