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Sturdy JEDEC IC Trays for Clean Production and Wafer Safety

Sturdy JEDEC IC Trays for Clean Production and Wafer Safety

Brand Name: Hiner-pack
Model Number: HN25016
MOQ: 500 pcs
Price: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
Payment Terms: T/T
Supply Ability: 2000PCS/Day
Detail Information
Place of Origin:
China
Certification:
ROHS, ISO
Tray Weight:
Varies, Typically Up To 500 Grams Per Cavity
Color:
Black
Quality Assurance:
Delivery Guarantee, Reliable Quality
Cavity Size:
322.6×135.9×9.35 Mm
Incoterms:
EXW, FOB, CIF, DDU, DDP
Mold Type:
Injection
Reusable:
Yes
Tray Shape:
Rectangular
Clean Class:
General And Ultrasonic Cleaning
Ic Type:
BGA,QFP,QFN,LGA,PGA
Packing Level:
Transport Package
Flatness:
Less Than 0.78mm
Capacity:
4X10=40 PCS
Packaging Details:
CARTON, PALLET
Supply Ability:
2000PCS/Day
Product Description
Sturdy JEDEC IC Trays for Clean Production and Wafer Safety
Guard delicate semiconductor wafers against dust and impact during production. Maintain rigid structural stability to keep components securely in place. Sustain clean production conditions to reduce contamination risks effectively. Looking for dependable tray solutions for secure wafer handling?

Integrate smoothly with automated handling systems and cleanroom workflows. Operate consistently in wafer transfer and precision assembly steps. Adapt flexibly to various semiconductor manufacturing and packaging workflows. Offer fully customizable cavity dimensions and grid arrangements. Meet strict clean production industry standards. Deliver personalized solutions that fit unique semiconductor manufacturing and quality assurance demands.
Key Features/ Benefits 
  • Strong durable structure
  • Effective dust prevention
  • Safeguard wafer packaging processes
  • Clean production support
  • Flexible customization
Specifications
Brand Hiner-pack
Model HN25016
Material PPE
Package Type JEDEC
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 322.6×135.9×9.35 mm
Cavity Size 23×23×0.8 mm
Matrix QTY 4X10=40 PCS
Warpage MAX 0.78mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
Widely used in wafer packaging, die sorting, semiconductor assembly and cleanroom processing. Perfect for high-precision production lines in semiconductor packaging and integrated circuit manufacturing.

Also applied in inter-plant wafer transportation, finished chip storage and logistics shipping. Serve IC packaging factories, semiconductor manufacturers and electronic component logistics providers.
Customized Services
Provide professional customization for JEDEC IC trays according to wafer size and production needs. Customize cavity shape, depth and arrangement to ensure perfect fit.

Select high-performance materials for anti-static, high temperature or cleanroom use. Support prototype verification and mass production. Offer full custom solutions for packaging and transportation.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers