Products

Home / Products / Waffle Pack Chip Trays /

Anti-Static Reusable Waffle Pack Chip Trays with Customizable Cavity Size for Semiconductor ICs

Brand Name:	Hiner-pack
Model Number:	HN24190
MOQ:	500 pcs
Price:	$1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）
Payment Terms:	T/T
Supply Ability:	2000PCS/Day

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

ROHS, ISO

Tray Weight:

Varies, Typically Up To 500 Grams Per Cavity

Color:

Black

Quality Assurance:

Delivery Guarantee, Reliable Quality

Outline Line Size:

50.8×50.8×4 Mm

Cavity Size:

2.2x1.35x0.53 Mm

Incoterms:

EXW, FOB, CIF, DDU, DDP

Mold Type:

Injection

Reusable:

Yes

Tray Shape:

Rectangular

Clean Class:

General And Ultrasonic Cleaning

Ic Type:

BGA,QFP,QFN,LGA,PGA

Packing Level:

Transport Package

Warpage:

Warpage MAX 0.23mm

Capacity:

10x9=90 PCS

Packaging Details:

CARTON, PALLET

Supply Ability:

2000PCS/Day

Highlight:

Anti-Static Waffle Pack Chip Trays

Reusable Semiconductor IC Trays

Customizable Cavity Size IC Chip Trays

Product Description

ESD Anti Static Semiconductor Waffle Chip Trays

Deliver precise waffle structure to cradle delicate IC chips tightly, eliminating movement and electrostatic damage during handling. Crafted from durable anti-static material to maintain consistent performance in industrial environments, offering reliable protection for sensitive semiconductor components.

Integrate seamlessly with automated packaging lines and cleanroom workflows, performing steadily in chip loading, transfer, and inventory management procedures. Adapt flexibly to diverse semiconductor manufacturing scenarios, supporting efficient production and logistics operations.

Support full customization of cavity size, spacing, and layout to match unique chip dimensions. Align with clean production standards, delivering tailored solutions that optimize packaging efficiency and safeguard IC chips throughout transit and storage.

Key Features/ Benefits

Deliver effective ESD anti-static performance
Anti-static protection
Suitable for Delicate Fine Pitch ICs
Secure chip holding
Support fully customized cavity sizes and layout designs
The factory has ISO certification, and the products comply with the RoHS standard.

Specifications

Brand		Hiner-pack
Model		HN24190
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		50.8×50.8×4 mm
Cavity Size		2.2x1.35x0.53 mm
Matrix QTY		10x9=90 PCS
Warpage		MAX 0.23mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Support semiconductor wafer dicing, die sorting, device testing, and precision component kitting operations. Work seamlessly with automated pick-and-place systems, ESD-controlled production lines, and clean manufacturing environments

Also applied in inter-plant component transfer, international shipping of sensitive chips, and long-term inventory storage. Serve semiconductor fabs, IC packaging facilities, and global electronic component distributors.

Packaging & Shipping/ Services

Provide fully customized solutions for anti-static waffle pack trays. Adjust cavity size, spacing, and layout to fit diverse chip dimensions.

Leverage durable anti-static material for enhanced protection. Offer prototype testing and personalized design support to meet unique production and packaging needs.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / Waffle pack trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

Tags:

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

Anti-Static Reusable Waffle Pack Chip Trays with Customizable Cavity Size for Semiconductor ICs

Anti-Static Reusable Waffle Pack Chip Trays with Customizable Cavity Size for Semiconductor ICs

Anti-Static Waffle Pack Chip Trays

Reusable Semiconductor IC Trays

Customizable Cavity Size IC Chip Trays

ABS waffle pack trays

ABS Waffle Pack Chip Trays

Waffle Pack Chip Trays

ABS Standard Waffle Pack Chip Trays High Temperature Resistance For Small Components

Customized Reusable Waffle Pack Chip Trays MPPO For Wafer Die

ABS MPPO Waffle Pack Bare Die Tray 36 PCS Optical Device Packaging

Customizable Black Colourful ESD Waffle Pack Chip Trays For IC RF VR Chips

Tiny Modules 4 Inch Waffle Pack Chip Trays ESD Stable Anti Static