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Heat-Resistant MPPO JEDEC IC Tray with Customizable Dimensions and Stable Structural Integrity

Brand Name:	Hiner-pack
Model Number:	HN25033
MOQ:	500 pcs
Price:	$1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
Payment Terms:	T/T
Supply Ability:	2000PCS/Day

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

ROHS, ISO

Tray Weight:

Varies, Typically Up To 500 Grams Per Cavity

Color:

Black

Quality Assurance:

Delivery Guarantee, Reliable Quality

Cavity Size:

322.6×135.9×8 Mm

Incoterms:

EXW, FOB, CIF, DDU, DDP

Mold Type:

Injection

Reusable:

Yes

Tray Shape:

Rectangular

Clean Class:

General And Ultrasonic Cleaning

Ic Type:

BGA,QFP,QFN,LGA,PGA

Packing Level:

Transport Package

Flatness:

Less Than 0.7mm

Capacity:

11X3=33 PCS

Packaging Details:

CARTON, PALLET

Supply Ability:

2000PCS/Day

Highlight:

Durable JEDEC IC Trays

Heat-Resistant MPPO IC Trays

JEDEC IC Trays with warranty

Product Description

Durable JEDEC IC Trays in Heat-Resistant MPPO for Stable Protection

JEDEC IC Tray is built for semiconductor packaging, crafted from heat-resistant MPPO material to withstand high temperatures while maintaining long-lasting structural stability. Its rigid design shields delicate ICs from shocks, dust, and moisture during storage and transport.

JEDEC IC Tray adapts to unique needs with fully customizable dimensions, cavity layouts, and branding options. Whether standard JEDEC formats or tailored configurations are required, it aligns perfectly with production and logistics workflows.

JEDEC IC Tray is trusted across semiconductor manufacturing, testing, and distribution. Its heat-resistant properties make it ideal for high-temperature processes, while its durable build ensures reliable protection throughout the entire supply chain.

Key Features/ Benefits

Sturdy structural integrity
Effective dust prevention
Short delivery time and good quality.
Heat-resistant MPPO material for high-temperature processes
Fully customizable dimensions and cavity layouts

Specifications

Brand		Hiner-pack
Model		HN25033
Material		MPPO
Package Type		JEDEC
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		322.6×135.9×8 mm
Cavity Size		21.04×28.42×2.72 mm
Matrix QTY		11X3=33 PCS
Warpage		MAX 0.7mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

JEDEC IC Tray is widely used in semiconductor wafer fabrication, IC testing, and final assembly lines. Its heat-resistant MPPO material makes it perfect for high-temperature processes like die attach and reflow soldering.

It also serves logistics and distribution teams, providing secure, stackable storage for finished ICs. Its customizable design ensures compatibility with automated handling systems, streamlining supply chain operations.

Customized Services

JEDEC IC Tray offers full customization for every design aspect. Adjust cavity size, pitch, and layout to match component dimensions. Add custom logos, part numbers, or anti-static markings for brand consistency.

The engineering team works closely with clients to optimize tray performance for specific applications. Whether small-batch prototypes or large-scale production runs are needed, tailored solutions enhance efficiency and protect valuable semiconductors.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / waffle pack trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

Tags:

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

Heat-Resistant MPPO JEDEC IC Tray with Customizable Dimensions and Stable Structural Integrity

Heat-Resistant MPPO JEDEC IC Tray with Customizable Dimensions and Stable Structural Integrity

Durable JEDEC IC Trays

Heat-Resistant MPPO IC Trays

JEDEC IC Trays with warranty

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