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Heat Resistant MPPO JEDEC IC Trays Safeguard Integrated Circuits From Contamination And Impact

Heat Resistant MPPO JEDEC IC Trays Safeguard Integrated Circuits From Contamination And Impact

Brand Name: Hiner-pack
Model Number: HN25035
MOQ: 500 pcs
Price: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
Payment Terms: T/T
Supply Ability: 2000PCS/Day
Detail Information
Place of Origin:
China
Certification:
ROHS, ISO
Tray Weight:
Varies, Typically Up To 500 Grams Per Cavity
Color:
Black
Quality Assurance:
Delivery Guarantee, Reliable Quality
Cavity Size:
9.81×10.87×1.5 Mm
Incoterms:
EXW, FOB, CIF, DDU, DDP
Mold Type:
Injection
Reusable:
Yes
Tray Shape:
Rectangular
Clean Class:
General And Ultrasonic Cleaning
Ic Type:
BGA,QFP,QFN,LGA,PGA
Packing Level:
Transport Package
Flatness:
Less Than 0.76mm
Capacity:
14X8=112 PCS
Packaging Details:
CARTON, PALLET
Supply Ability:
2000PCS/Day
Highlight:

Heat resistant JEDEC IC trays

,

MPPO IC trays for contamination protection

,

Impact resistant JEDEC integrated circuit trays

Product Description
Heat Resistant MPPO JEDEC IC Trays Safeguard Integrated Circuits From Contamination And Impact
JEDEC IC Tray is crafted from heat-resistant MPPO material, designed to protect delicate integrated circuits from contamination and physical impact. Rigid structure keeps ICs stable and secure during automated handling and transport.
 
JEDEC IC Tray adapts to diverse production needs with customizable cavity layouts and dimensions. Whether standard JEDEC specifications or tailored component sizes, it integrates seamlessly into manufacturing and logistics workflows.
 
JEDEC IC Tray ensures reliable protection across IC fabrication, testing, and distribution. Heat-resistant properties withstand high-temperature processes, while anti-contamination design preserves component integrity throughout the supply chain.

Key Features/ Benefits 
  • Heat-resistant MPPO material (up to 150°C)
  • ISO certified production
  • Anti-contamination surface design
  • Clean production support
  • Flexible customization
Specifications
Brand Hiner-pack
Model HN25035
Material MPPO
Package Type JEDEC
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 322.6×135.9×7.62 mm
Cavity Size 9.81×10.87×1.5 mm
Matrix QTY 14X8=112 PCS
Warpage MAX 0.76mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
JEDEC IC Tray is widely used in semiconductor IC fabrication, testing, and assembly lines. Heat-resistant MPPO material withstands high-temperature processes, protecting chips from thermal damage and contamination.
 
JEDEC IC Tray also serves logistics and packaging teams, providing secure, stackable storage for finished ICs. Customized design ensures compatibility with automated handling systems, reducing manual errors and improving supply chain efficiency.
Customized Services
JEDEC IC Tray offers full customization for every design detail. Adjust cavity size, pitch, and layout to match unique IC dimensions. Add custom markings, notches, or anti-static features for better production line compatibility.

Engineering team collaborates closely to develop tailored tray solutions, from prototype to mass production. Whether small-batch prototypes or large-scale runs, JEDEC IC Tray delivers precise, reliable protection for valuable semiconductor components.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers