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150°C Heat-Resistant MPPO JEDEC IC Tray with Customizable Cavities for Semiconductor Packaging

150°C Heat-Resistant MPPO JEDEC IC Tray with Customizable Cavities for Semiconductor Packaging

Brand Name: Hiner-pack
Model Number: HN25038
MOQ: 500 pcs
Price: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
Payment Terms: T/T
Supply Ability: 2000PCS/Day
Detail Information
Place of Origin:
China
Certification:
ROHS, ISO
Tray Weight:
Varies, Typically Up To 500 Grams Per Cavity
Color:
Black
Quality Assurance:
Delivery Guarantee, Reliable Quality
Cavity Size:
322.6×135.9×10 Mm
Incoterms:
EXW, FOB, CIF, DDU, DDP
Mold Type:
Injection
Reusable:
Yes
Tray Shape:
Rectangular
Clean Class:
General And Ultrasonic Cleaning
Ic Type:
BGA,QFP,QFN,LGA,PGA
Packing Level:
Transport Package
Flatness:
Less Than 0.76mm
Capacity:
15X6=90 PCS
Packaging Details:
CARTON, PALLET
Supply Ability:
2000PCS/Day
Highlight:

150°C Heat-Resistant JEDEC IC Tray

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Customizable Cavities Semiconductor Packaging Tray

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MPPO Material IC Matrix Tray

Product Description
Heat-Resistant MPPO JEDEC IC Trays with Customizable Cavities for Semiconductor Packaging
Heat-Resistant MPPO JEDEC IC Tray is built for semiconductor packaging, with customizable cavities to fit various component shapes and sizes. Sturdy structure secures components during high-temperature production and automated handling.

Heat-Resistant MPPO JEDEC IC Tray withstands up to 150°C, shielding components from heat damage and contamination. It follows JEDEC standards, ensuring seamless integration into existing production lines.

Heat-Resistant MPPO JEDEC IC Tray lowers component failure rates and boosts production consistency. Customizable designs cater to unique packaging requirements, making it a trusted choice for precision semiconductor manufacturing.
Key Features/ Benefits 
  • 150°C heat-resistant MPPO material
  • Heat-proof and anti-contamination
  • Support small batch production in the first batch.
  • More than 12 years of export experience.
  • With professional engineers and efficient management.
Specifications
Brand Hiner-pack
Model HN25038
Material  MPPO
Package Type JEDEC
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 322.6×135.9×10 mm
Cavity Size 15.5×10.12×3.35 mm
Matrix QTY 15X6=90 PCS
Warpage MAX 0.76mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
Heat-Resistant MPPO JEDEC IC Tray is ideal for semiconductor packaging, high-temperature testing, and SMT assembly lines. It protects sensitive components during thermal processes, maintaining product integrity.

Heat-Resistant MPPO JEDEC IC Tray also supports logistics and storage, offering stackable design for finished devices. Custom cavities fit automated handling systems, reducing manual errors and improving supply chain efficiency.
Packaging & Shipping/ Services
Offer reliable packaging and shipping services tailored to your IC tray orders. Use professional protective packaging to prevent damage during transit, ensuring products arrive in perfect condition. Choose from multiple shipping options to meet your delivery timeline, with global logistics support for seamless cross-border delivery.

Provide real-time tracking and order updates for full visibility. Handle customs clearance and documentation efficiently for international shipments, minimizing delays. Prioritize safe, on-time delivery to support your production and supply chain needs.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / Waffle Pack Trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers