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JEDEC IC Trays for Dust Reduction and Durable Protection in Semiconductor Packaging

JEDEC IC Trays for Dust Reduction and Durable Protection in Semiconductor Packaging

Brand Name: Hiner-pack
Model Number: HN25046
MOQ: 500 pcs
Price: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
Payment Terms: T/T
Supply Ability: 2000PCS/Day
Detail Information
Place of Origin:
China
Certification:
ROHS, ISO
Tray Weight:
Varies, Typically Up To 500 Grams Per Cavity
Color:
Black
Quality Assurance:
Delivery Guarantee, Reliable Quality
Cavity Size:
322.6×135.9×7.62 Mm
Incoterms:
EXW, FOB, CIF, DDU, DDP
Mold Type:
Injection
Reusable:
Yes
Tray Shape:
Rectangular
Clean Class:
General And Ultrasonic Cleaning
Ic Type:
BGA,QFP,QFN,LGA,PGA
Packing Level:
Transport Package
Flatness:
Less Than 0.76mm
Capacity:
7x15=105 PCS
Packaging Details:
CARTON, PALLET
Supply Ability:
2000PCS/Day
Product Description
JEDEC IC Trays for Dust Reduction and Durable Protection in Semiconductor Packaging 
JEDEC IC Tray is engineered to minimize dust contamination, keeping semiconductor components clean throughout packaging processes. Sturdy structure ensures reliable protection against impacts and scratches during handling.

JEDEC IC Tray meets strict JEDEC standards, guaranteeing compatibility with automated production lines. It maintains component integrity, reducing waste and supporting consistent quality control.

JEDEC IC Tray adapts to diverse component sizes with customizable cavity designs. Whether for high-volume manufacturing or precision storage, it provides clean, durable protection for sensitive semiconductor parts.
Key Features/ Benefits 
  • Deliver durable construction.
  • Dust reduction and anti-contamination
  • RoHS compliant materials
  • Comply with JEDEC standards.
  • Support custom design solutions.
Specifications
Brand Hiner-pack
Model HN25046
Material MPPO
Package Type JEDEC
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 322.6×135.9×7.62 mm
Cavity Size 11.8×13.7×3.1 mm
Matrix QTY 7x15=105 PCS
Warpage MAX 0.76mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
JEDEC IC Tray is ideal for semiconductor packaging, clean room manufacturing, and IC testing lines. It prevents dust buildup, maintaining component purity during high-precision production.

JEDEC IC Tray also supports component storage and logistics, offering stable protection during transport. Custom cavities secure components, minimizing damage and ensuring performance remains intact until assembly.
Packaging & Shipping/ Services
JEDEC Matrix Trays are packaged in durable, anti-static materials with secure stacking and cushioning inserts to protect products during transit. Customized packaging solutions are available upon request to meet specific handling and storage needs.

All shipments are tracked and handled by trusted carriers for reliable worldwide delivery. Professional logistics support ensures timely, safe arrival of orders, with efficient customs clearance and documentation for international shipments.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / Waffle Pack Trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers