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Durable Waffle Pack Chip Trays Featuring Uniform Grids For Safe Fine Pitch IC Storage

Brand Name:	Hiner-pack
Model Number:	HN24240
MOQ:	500 pcs
Price:	$1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）
Payment Terms:	T/T
Supply Ability:	2000PCS/Day

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

ROHS, ISO

Tray Weight:

Varies, Typically Up To 500 Grams Per Cavity

Color:

Black

Quality Assurance:

Delivery Guarantee, Reliable Quality

Outline Line Size:

50.7×50.7×4mm

Cavity Size:

4.85X2.75X0.5 Mm

Incoterms:

EXW, FOB, CIF, DDU, DDP

Mold Type:

Injection

Reusable:

Yes

Tray Shape:

Rectangular

Clean Class:

General And Ultrasonic Cleaning

Ic Type:

BGA,QFP,QFN,LGA,PGA

Packing Level:

Transport Package

Warpage:

Warpage MAX 0.26mm

Capacity:

11x7=77 PCS

Packaging Details:

CARTON, PALLET

Supply Ability:

2000PCS/Day

Product Description

Durable Waffle Pack Chip Trays featuring Uniform Grids for Safe Fine Pitch IC Storage

Searching for reliable packaging to safeguard delicate fine pitch ICs?

Built with evenly spaced grid compartments to firmly lock components. Prevent chips from shifting and collision during handling, transit and storage.

Deliver steady anti-static performance to shield sensitive semiconductors. Fit repeated circulation inside electronic manufacturing workshops.

Support flexible structural adjustments to match diverse chip dimensions. Meet varied packaging demands across semiconductor and electronics industries.

Key Features/ Benefits

Reliable ESD protection for sensitive semiconductor parts
Precise grid cavities for stable component holding
Stackable layout to save storage and shipping space
Support fully customized cavity sizes and layout designs
Precise waffle structure.

Specifications

Brand		Hiner-pack
Model		HN24240
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		50.7×50.7×4mm
Cavity Size		4.85X2.75X0.5 mm
Matrix QTY		11x7=77 PCS
Warpage		MAX 0.26mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Perfect for storing and transporting integrated circuits, chips, sensors and other precision microelectronic components. Effectively guard fragile fine-pitch devices against static damage and physical abrasion in every workflow.

Widely adopted by semiconductor factories, electronic component suppliers and SMT assembly workshops. Suitable for chip inspection, production turnover, finished goods storage and cross-regional shipment of electronic parts.

Packaging & Shipping/ Services

Adopt scientific stacking method to avoid extrusion and deformation of trays. Outer carton packaging with buffer materials reduces impact risks during long-distance ocean and air freight.

Flexible packing quantity can be arranged according to your order scale. Strict packing standard ensures intact delivery. Stable packaging solution fits regular bulk shipments for global semiconductor buyers.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / Waffle Pack Trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

Tags:

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

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