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Durable Waffle Pack Chip Trays with Uniform Grid to Secure Fine Pitch ICs

Brand Name:	Hiner-pack
Model Number:	HN25002
MOQ:	500 pcs
Price:	$1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）
Payment Terms:	T/T
Supply Ability:	2000PCS/Day

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

ROHS, ISO

Tray Weight:

Varies, Typically Up To 500 Grams Per Cavity

Color:

Black

Quality Assurance:

Delivery Guarantee, Reliable Quality

Outline Line Size:

50.7×50.7×4 Mm

Cavity Size:

0.70X0.64X0.47 Mm

Incoterms:

EXW, FOB, CIF, DDU, DDP

Mold Type:

Injection

Reusable:

Yes

Tray Shape:

Rectangular

Clean Class:

General And Ultrasonic Cleaning

Ic Type:

BGA,QFP,QFN,LGA,PGA

Packing Level:

Transport Package

Warpage:

Warpage MAX 0.25mm

Capacity:

24x23=552 PCS

Packaging Details:

CARTON, PALLET

Supply Ability:

2000PCS/Day

Product Description

Durable Waffle Pack Chip Trays with Uniform Grid to Secure Fine Pitch ICs

Tired of ordinary trays failing to protect compact fine pitch microchips during turnover?

Boast high-density uniform cavity layout to hold numerous tiny components separately. Eliminate mutual friction, displacement and surface damage amid frequent workshop operations.

Deliver sustained electrostatic discharge performance. Keep fragile semiconductor devices safe from static risks and support long-term repeated circulation.

Adapt cavity arrangement and overall sizes according to component specifications. Create exclusive storage solutions to fit various electronic production scenarios.

Key Features/ Benefits

Constant ESD performance for delicate microchips
High-density cavities for large-capacity storage
Stackable design to cut warehouse occupation
Protects delicate fine pitch IC components efficiently
Support fully customized cavity sizes and layout designs

Specifications

Brand		Hiner-pack
Model		HN25002
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		50.7×50.7×4 mm
Cavity Size		0.70X0.64X0.47mm
Matrix QTY		24x23=552 PCS
Warpage		MAX 0.25mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Ideal for storing and transporting microchips, integrated circuits and miniature electronic parts. Isolate each component to reduce scratch, collision and electrostatic damage risks.

Well suited for semiconductor factories, component distributors and SMT workshops. Serve chip testing, production transfer and finished product logistics management.

Packaging & Shipping/ Services

We arrange neat palletized packing lined with shockproof fillers. Reinforced export cartons prevent squeezing and impact during sea and air shipments.

Packing quantity can be adjusted as your request. Strict inspection before shipment ensures goods reach your destination in perfect condition.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / waffle pack trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

Tags:

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

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