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Heavy Duty Waffle Pack Chip Trays with Uniform Grid for Fine Pitch IC Protection

Brand Name:	Hiner-pack
Model Number:	HN25003
MOQ:	500 pcs
Price:	$1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）
Payment Terms:	T/T
Supply Ability:	2000PCS/Day

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

ROHS, ISO

Tray Weight:

Varies, Typically Up To 500 Grams Per Cavity

Color:

Black

Quality Assurance:

Delivery Guarantee, Reliable Quality

Outline Line Size:

50.7×50.7×7.4 Mm

Cavity Size:

1.08X0.75X0.25 Mm

Incoterms:

EXW, FOB, CIF, DDU, DDP

Mold Type:

Injection

Reusable:

Yes

Tray Shape:

Rectangular

Clean Class:

General And Ultrasonic Cleaning

Ic Type:

BGA,QFP,QFN,LGA,PGA

Packing Level:

Transport Package

Warpage:

Warpage MAX 0.26mm

Capacity:

22x19=418 PCS

Packaging Details:

CARTON, PALLET

Supply Ability:

2000PCS/Day

Product Description

Heavy Duty Waffle Pack Chip Trays with Uniform Grid for Fine Pitch IC Protection

Looking for dependable carriers to safeguard miniature semiconductor components?

Own abundant independent precision cavities to separate each chip. Avoid mutual collision and surface wear during testing, transfer and inventory arrangement.

Possess lasting conductive performance to resist static hazards. Fully adapt to long-cycle repeated operation inside electronic manufacturing workshops.

Adjust cavity layout and overall dimensions flexibly. Provide personalized storage solutions to satisfy diverse production requirements worldwide.

Key Features/ Benefits

Steady conductive & anti-static capability
Durable industrial conductive plastic body
Stable component holding
Multiple independent precision cavities
Precise waffle structure.

Specifications

Brand		Hiner-pack
Model		HN25003
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		50.7×50.7×7.4 mm
Cavity Size		1.08X0.75X0.25 mm
Matrix QTY		22x19=418 PCS
Warpage		MAX 0.26mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Suitable for storage and circulation of fine pitch ICs, micro semiconductors and tiny electronic parts. Isolate components to reduce mechanical damage and electrostatic risks.

Ideal for semiconductor factories, component vendors and SMT workshops to complete chip testing, production transfer and stock management work.

Packaging & Shipping/ Services

All goods are packed in reinforced export cartons with shockproof fillers. Internal fixation prevents sliding and extrusion. Uniform packing standards are implemented. Comprehensive pre-shipment inspection ensures safe delivery by sea or air transportation.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / waffle pack trays

In-house mold design capability

Fast prototype development

Strict QC process

Stable supply for global semiconductor customers

Tags:

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

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