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Durable High-Temperature Resistant Reusable Waffle Pack Chip Trays for Fine Pitch IC Protection

Brand Name:	Hiner-pack
Model Number:	HN25010
MOQ:	500 pcs
Price:	$1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）
Payment Terms:	T/T
Supply Ability:	2000PCS/Day

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

ROHS, ISO

Tray Weight:

Varies, Typically Up To 500 Grams Per Cavity

Color:

Black

Quality Assurance:

Delivery Guarantee, Reliable Quality

Outline Line Size:

50.8×50.8×3.94 Mm

Cavity Size:

6.04x3.63x0.67 Mm

Incoterms:

EXW, FOB, CIF, DDU, DDP

Mold Type:

Injection

Reusable:

Yes

Tray Shape:

Rectangular

Clean Class:

General And Ultrasonic Cleaning

Ic Type:

BGA,QFP,QFN,LGA,PGA

Packing Level:

Transport Package

Warpage:

Warpage MAX 0.2mm

Capacity:

5x7=35 PCS

Packaging Details:

CARTON, PALLET

Supply Ability:

2000PCS/Day

Highlight:

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Product Description

Durable High‑Temp Waffle Pack Chip Trays for Semiconductor IC Chips

Block static charges that ruin sensitive semiconductor dies. Tolerate repeated high‑temperature exposure without warping. Hunting for robust carriers for precision chip parts? Stand firm against harsh conditions inside busy production lines.

Lock fine‑pitch IC units inside neat grid cavities. Stop unwanted shifting while chips undergo testing and sorting. Eliminate scratches and impact risks to costly semiconductor components. Bring reliable protection across full processing cycles.

Survive countless cycles of loading and unloading. Keep solid dimensional performance under continuous mass‑production use. Satisfy strict protection requirements from semiconductor assembly operations.

Key Features/ Benefits

Endure high‑temperature conditions
Avoid chip shift & collision
Suitable for Delicate Fine Pitch ICs
Protects delicate fine pitch IC components efficiently
Support fully customized cavity sizes and layout designs
The factory has ISO certification, and the products comply with the RoHS standard.

Specifications

Brand		Hiner-pack
Model		HN25010
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		50.8×50.8×3.94 mm
Cavity Size		6.04x3.63x0.67 mm
Matrix QTY		5x7=35 PCS
Warpage		MAX 0.2mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Support semiconductor assembly, chip testing and component transit. Protect fine‑pitch ICs through reflow, sorting and inspection. Reduce scrap loss triggered by static electricity and mechanical impact.

Fit electronics OEM workshops and component warehouses. Provide safe containment for varied integrated‑circuit units during regular large‑batch handling tasks.

Packaging & Shipping/ Services

Pack goods with firm cartons and inner cushioning materials to avoid transit deformation. Arrange shipment via air or sea upon customer confirmation. Provide full shipping documents after dispatch. Track cargo status and update relevant information timely for overseas clients.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / Waffle Pack Trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

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Waffle Pack Lids Clips

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Metal Wafer Cassette

Durable High-Temperature Resistant Reusable Waffle Pack Chip Trays for Fine Pitch IC Protection

Durable High-Temperature Resistant Reusable Waffle Pack Chip Trays for Fine Pitch IC Protection

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