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Heat-Resistant Anti-Static Waffle Pack Trays with Customizable Cavity Sizes for Semiconductor IC Chips

Brand Name:	Hiner-pack
Model Number:	HN25013
MOQ:	500 pcs
Price:	$1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）
Payment Terms:	T/T
Supply Ability:	2000PCS/Day

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

ROHS, ISO

Tray Weight:

Varies, Typically Up To 500 Grams Per Cavity

Color:

Black

Quality Assurance:

Delivery Guarantee, Reliable Quality

Outline Line Size:

50.7×50.7×4 Mm

Cavity Size:

10.2x4.2x0.45 Mm

Incoterms:

EXW, FOB, CIF, DDU, DDP

Mold Type:

Injection

Reusable:

Yes

Tray Shape:

Rectangular

Clean Class:

General And Ultrasonic Cleaning

Ic Type:

BGA,QFP,QFN,LGA,PGA

Packing Level:

Transport Package

Warpage:

Warpage MAX 0.21mm

Capacity:

50.7×50.7×4 Mm

Packaging Details:

CARTON, PALLET

Supply Ability:

2000PCS/Day

Highlight:

Heat-resistant waffle pack trays

Anti-static semiconductor IC trays

Waffle pack chip storage trays

Product Description

Heat‑Resistant Anti‑Static Waffle Pack Trays for Semiconductor IC Chips

Block static discharge that damages delicate semiconductor components. Maintain stable shape under repeated high‑temperature process cycles. Searching for dependable carriers for precision IC units? Stand up to rigorous conditions inside high‑output production workshops.

Hold precision chips within engraved grid cavities. Prevent displacement and surface scratches during handling operations. Lower component rejection risks caused by static shock and physical impact. Deliver steady protective performance across full production sequences.

Endure repeated stacking and frequent loading‑unloading cycles. Keep consistent dimensional performance amid continuous mass‑volume usage. Satisfy strict protection requirements for semiconductor assembly and test workflows.

Key Features/ Benefits

ESD protection
High temperature resistance
Suitable for Delicate Fine Pitch ICs
Protects delicate fine pitch IC components efficiently
Support fully customized cavity sizes and layout designs
The factory has ISO certification, and the products comply with the RoHS standard.

Specifications

Brand		Hiner-pack
Model		HN25013
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		50.7×50.7×4 mm
Cavity Size		10.2x4.2x0.45 mm
Matrix QTY		50.7×50.7×4 mm
Warpage		MAX 0.21mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Serve semiconductor assembly, chip sorting and performance testing. Protect precision IC parts through thermal treatment, inspection and transit phases. Cut loss brought by static electricity and mechanical abrasion.

Fit component warehouses and electronics OEM production sites. Provide safe containment for varied precision semiconductor parts during large‑batch handling tasks.

Packaging & Shipping/ Services

Use heavy‑duty corrugated cartons paired with shock‑absorbent inner fillers for finished goods. Apply firm strapping to avoid squeezing or shifting inside packages. Take extra care for semiconductor‑grade goods to eliminate risk of deformation or surface scratch before shipment.

Arrange air, sea or express delivery strictly based on shipping instructions from buyers. Generate full‑set shipping papers once goods depart warehouse. Track cargo movement actively and feed latest logistics status to overseas clients throughout whole delivery cycle.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / waffle pack trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

Tags:

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

Heat-Resistant Anti-Static Waffle Pack Trays with Customizable Cavity Sizes for Semiconductor IC Chips

Heat-Resistant Anti-Static Waffle Pack Trays with Customizable Cavity Sizes for Semiconductor IC Chips

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Anti-static semiconductor IC trays

Waffle pack chip storage trays

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