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Reusable Waffle Pack Chip Trays with Uniform Grids for Fine-Pitch IC Protection

Brand Name:	Hiner-pack
Model Number:	HN25019
MOQ:	500 pcs
Price:	$1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）
Payment Terms:	T/T
Supply Ability:	2000PCS/Day

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

ROHS, ISO

Tray Weight:

Varies, Typically Up To 500 Grams Per Cavity

Color:

Black

Quality Assurance:

Delivery Guarantee, Reliable Quality

Outline Line Size:

50.7×50.7×4mm

Cavity Size:

5.5X3.2X0.38 Mm

Incoterms:

EXW, FOB, CIF, DDU, DDP

Mold Type:

Injection

Reusable:

Yes

Tray Shape:

Rectangular

Clean Class:

General And Ultrasonic Cleaning

Ic Type:

BGA,QFP,QFN,LGA,PGA

Packing Level:

Transport Package

Warpage:

Warpage MAX 0.23mm

Capacity:

6x10=60 PCS

Packaging Details:

CARTON, PALLET

Supply Ability:

2000PCS/Day

Highlight:

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Product Description

Waffle Pack Chip Trays with Uniform Grids for Fine‑Pitch IC Protection

Lock fragile fine‑pitch IC parts inside precision grid cavities. Prevent tiny semiconductor units from sliding amid frequent handling work. Hunting for dependable carriers for miniature chips? Sustain stable performance over countless working cycles.

Defend chips against collision and surface scratch throughout manufacturing flows. Cut scrap risks caused by random component movement. Adapt well to high‑speed production workflows without extra modification. Keep chip placement steady in testing, checking and transfer procedures.

Allow stacked placement to conserve valuable factory workspace. Maintain accurate dimensions under long‑term heavy‑duty usage. Satisfy strict holding standards for sophisticated semiconductor assembly processes.

Key Features/ Benefits

Reliable ESD protection for sensitive semiconductor parts
Precise grid cavities for stable component holding
Precision grids for accurate component alignment
Support fully customized cavity sizes and layout designs
Precise waffle structure.

Specifications

Brand		Hiner-pack
Model		HN25019
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		50.7×50.7×4mm
Cavity Size		5.5X3.2X0.38 mm
Matrix QTY		6x10=60 PCS
Warpage		MAX 0.23mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Handle fine‑pitch IC sorting, performance testing and component assembly work. Shield miniature semiconductor chips during inspection and intra‑factory transfer. Minimize losses resulting from part displacement and surface damage.

Work within electronics production plants and component inventory areas. Provide dependable holding solution for multiple precision chips during large‑batch processing assignments.

Packaging & Shipping/ Services

Seal every lot with anti‑static inner bags before loading heavy‑duty export cartons. Fill cushion materials to guard goods against squeeze damage. Carry out full‑item checking before dispatching semiconductor‑grade products.

Arrange sea freight, air freight or courier service per buyers’ confirmed shipping plans. Issue full shipping paperwork once goods leave warehouse. Share latest logistics status timely with overseas purchasers.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / Waffle Pack Trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

Tags:

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

Reusable Waffle Pack Chip Trays with Uniform Grids for Fine-Pitch IC Protection

Reusable Waffle Pack Chip Trays with Uniform Grids for Fine-Pitch IC Protection

waffle pack chip trays with uniform grids

fine-pitch IC protection waffle trays

waffle pack trays for IC protection

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