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Uniform-Grid Reusable Waffle Pack Chip Trays for Fine-Pitch IC Protection and Transit

Brand Name:	Hiner-pack
Model Number:	HN25021
MOQ:	500 pcs
Price:	$1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）
Payment Terms:	T/T
Supply Ability:	2000PCS/Day

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

ROHS, ISO

Tray Weight:

Varies, Typically Up To 500 Grams Per Cavity

Color:

Black

Quality Assurance:

Delivery Guarantee, Reliable Quality

Outline Line Size:

50.7×50.7×4 Mm

Cavity Size:

1.4X1.0X0.65 Mm

Incoterms:

EXW, FOB, CIF, DDU, DDP

Mold Type:

Injection

Reusable:

Yes

Tray Shape:

Rectangular

Clean Class:

General And Ultrasonic Cleaning

Ic Type:

BGA,QFP,QFN,LGA,PGA

Packing Level:

Transport Package

Warpage:

Warpage MAX 0.25mm

Capacity:

21X18=378 PCS

Packaging Details:

CARTON, PALLET

Supply Ability:

2000PCS/Day

Highlight:

Uniform-Grid waffle trays for IC turnover

Durable waffle trays for fine-pitch IC

Waffle pack chip trays with transit protection

Product Description

Uniform‑Grid Durable Waffle Trays for Fine‑Pitch IC Turnover and Transit Protection

Hold delicate fine‑pitch ICs inside neat grid cavities. Stop tiny semiconductor chips from shifting amid frequent handling. Deliver steady performance through repeated turnover cycles to fit continuous manufacturing rhythms.

Absorb minor impact and lower scratch and collision risks. Cut component rejects brought by unstable chip placement. Adapt well to high‑speed manufacturing flows without complicated adjustments. Keep chip positions secure through testing, checking and cross‑workshop transfer.

Enable safe stacking to save valuable production workspace. Maintain rigid structure under continuous transit and turnover conditions. Satisfy strict protection requirements for advanced semiconductor component processing.

Key Features/ Benefits

Stabilize fine‑pitch ICs during handling
Resist scratch and physical impact
Support secure multi‑layer stacking
Protects delicate fine pitch IC components efficiently
Support fully customized cavity sizes and layout designs

Specifications

Brand		Hiner-pack
Model		HN25021
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		50.7×50.7×4 mm
Cavity Size		1.4X1.0X0.65mm
Matrix QTY		21X18=378 PCS
Warpage		MAX 0.25mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Serve fine‑pitch IC sorting, performance testing and intra‑factory turnover tasks. Protect miniature semiconductor chips through inspection and station‑to‑station transfer. Cut losses resulting from component displacement and surface abrasion.

Fit semiconductor manufacturing sites and component transit processes. Deliver dependable holding solutions for various precision chips during large‑batch turnover operations.

Packaging & Shipping/ Services

Seal every batch with anti‑static bags before loading reinforced export cartons. Add shock‑resistant fillers to buffer vibration and compression harm. Carry out full appearance inspection prior to dispatching semiconductor‑grade goods.

Arrange shipment modes strictly following confirmed customer requirements. Generate complete set of shipping paperwork once goods leave warehouse. Keep overseas buyers updated on latest cargo delivery progress.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / Waffle Pack Trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

Tags:

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

Uniform-Grid Reusable Waffle Pack Chip Trays for Fine-Pitch IC Protection and Transit

Uniform-Grid Reusable Waffle Pack Chip Trays for Fine-Pitch IC Protection and Transit

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