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Durable JEDEC IC Trays For Semiconductor Clean Protection

Durable JEDEC IC Trays For Semiconductor Clean Protection

Brand Name: Hiner-pack
Model Number: HN25068
MOQ: 500 pcs
Price: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
Payment Terms: T/T
Supply Ability: 2000PCS/Day
Detail Information
Place of Origin:
China
Certification:
ROHS, ISO
Tray Weight:
Varies, Typically Up To 500 Grams Per Cavity
Color:
Black
Quality Assurance:
Delivery Guarantee, Reliable Quality
Cavity Size:
322.6×135.9×7.62 Mm
Incoterms:
EXW, FOB, CIF, DDU, DDP
Mold Type:
Injection
Reusable:
Yes
Tray Shape:
Rectangular
Clean Class:
General And Ultrasonic Cleaning
Ic Type:
BGA,QFP,QFN,LGA,PGA
Packing Level:
Transport Package
Flatness:
Less Than 0.76mm
Capacity:
13x5=65 PCS
Packaging Details:
CARTON, PALLET
Supply Ability:
2000PCS/Day
Product Description
Durable JEDEC IC Trays For Semiconductor Clean Protection

Offer rigid grid cavity structures to firmly lock semiconductor chips in place. Prevent component shift and collision across test transfer and storage cycles. Seek reliable component holding solutions for production lines? Stand heavy‑duty repeated operations to cut chip damage risk.


Provide stable anti‑static performance to shield sensitive semiconductors from static harm. Keep chip surfaces clean throughout whole handling workflows. Stand consistent performance under long‑run clean‑room manufacturing conditions.


Support full custom cavity size depth and layout adjustments. Match diverse chip dimension requirements. Adapt automated pick‑and‑place equipment and multiple production scenarios to satisfy varied semiconductor manufacturing demands.

Key Features/ Benefits 
  • RoHS compliant materials
  • Reliable ESD anti‑static protection
  • Rigid grid cavity structure
  • Secure component retention
  • JEDEC standard compliance
Specifications
Brand Hiner-pack
Model HN25068
Material PC
Package Type JEDEC
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 322.6×135.9×7.62 mm
Cavity Size 19.45×22.42 mm
Matrix QTY 13x5=65 PCS
Warpage MAX 0.76mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications

Fit semiconductor chip storage, production transfer and component testing. Work well with automated pick‑and‑place equipment and clean‑room environments. Serve short‑term placement and long‑term chip safekeeping.


Apply widely for semiconductor factories IC packaging workshops and component warehouses. Support on‑site production cross‑workshop transfer and high‑precision component preservation work.

Packaging & Shipping/ Services
Wrap each tray with anti‑static film for full ESD protection. Pack inside anti‑static cartons with foam padding against impact damage. Support pallet stacking for bulk orders. Supply sea air and express shipping with full order tracking for intact on‑time arrival.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / Waffle Pack Trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers