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Sturdy JEDEC IC Trays Protect Semiconductors From Dust Scratches Impact

Brand Name:	Hiner-pack
Model Number:	HN25069
MOQ:	500 pcs
Price:	$1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
Payment Terms:	T/T
Supply Ability:	2000PCS/Day

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

ROHS, ISO

Tray Weight:

Varies, Typically Up To 500 Grams Per Cavity

Color:

Black

Quality Assurance:

Delivery Guarantee, Reliable Quality

Cavity Size:

322.6×135.9×7.62 Mm

Incoterms:

EXW, FOB, CIF, DDU, DDP

Mold Type:

Injection

Reusable:

Yes

Tray Shape:

Rectangular

Clean Class:

General And Ultrasonic Cleaning

Ic Type:

BGA,QFP,QFN,LGA,PGA

Packing Level:

Transport Package

Flatness:

Less Than 0.76mm

Capacity:

5x6=30 PCS

Packaging Details:

CARTON, PALLET

Supply Ability:

2000PCS/Day

Product Description

Sturdy JEDEC IC Trays Protect Semiconductors From Dust Scratches Impact

Carry sturdy grid cavity design to firmly hold semiconductor chips. Block dust scratches and impact across test transfer and shipment cycles. Search stable component holding solutions for production lines? Endure repeated heavy‑duty use and lower chip damage risks.

Offer reliable anti‑static performance to guard sensitive semiconductor parts. Keep chip surfaces clean through full handling procedures. Maintain stable output inside strict clean‑room manufacturing surroundings.

Support full custom cavity dimension and layout adjustment. Fit varied chip size requirements. Work with automated pick‑and‑place equipment to satisfy diverse semiconductor manufacturing demands.

Key Features/ Benefits

RoHS compliant materials
Dust and contamination control
Sturdy grid cavity construction
Fully custom cavity layout
Repeated heavy‑duty usability

Specifications

Brand		Hiner-pack
Model		HN25069
Material		PC
Package Type		JEDEC
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		322.6×135.9×7.5 mm
Cavity Size		44.19×18.71 mm
Matrix QTY		5x6=30 PCS
Warpage		MAX 0.76mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Fit semiconductor chip storage component testing and production transfer. Match automated pick‑and‑place machines and clean‑room environments. Support short‑term placement and long‑term chip preservation.

Serve semiconductor factories IC packaging workshops and component warehouses. Handle cross‑workshop production transfer and high‑precision component protection tasks.

Packaging & Shipping/ Services

Durable JEDEC IC Trays are packaged in anti-static, durable materials with secure stacking and cushioning inserts. Custom packaging solutions are available to meet specific handling and storage requirements.

All shipments are tracked and handled by trusted carriers for reliable worldwide delivery. Professional logistics support ensures timely, safe arrival, with efficient customs clearance and documentation for international orders.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / Waffle Pack Trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

Tags:

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

Sturdy JEDEC IC Trays Protect Semiconductors From Dust Scratches Impact

Sturdy JEDEC IC Trays Protect Semiconductors From Dust Scratches Impact

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