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Customizable Cavity PPE JEDEC IC Trays Heat‑Resistant For Semiconductor Packaging

Brand Name:	Hiner-pack
Model Number:	HN25074
MOQ:	500 pcs
Price:	$1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
Payment Terms:	T/T
Supply Ability:	2000PCS/Day

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

ROHS, ISO

Tray Weight:

Varies, Typically Up To 500 Grams Per Cavity

Color:

Black

Quality Assurance:

Delivery Guarantee, Reliable Quality

Cavity Size:

322.6×135.9×9.35 Mm

Incoterms:

EXW, FOB, CIF, DDU, DDP

Mold Type:

Injection

Reusable:

Yes

Tray Shape:

Rectangular

Clean Class:

General And Ultrasonic Cleaning

Ic Type:

BGA,QFP,QFN,LGA,PGA

Packing Level:

Transport Package

Flatness:

Less Than 0.76mm

Capacity:

4×14＝56 PCS

Packaging Details:

CARTON, PALLET

Supply Ability:

2000PCS/Day

Product Description

Customizable Cavity PPE JEDEC IC Trays Heat‑Resistant For Semiconductor Packaging

Looking for reliable holders for delicate semiconductor chips? Built from robust PPE material, deliver solid protection during chip test and packaging. Stand up to high heat and block dust harm for sensitive electronic units.

Fit diverse chip specifications. Custom cavity design acts as core service. Adjust cavity layout, dimensions to satisfy varied semiconductor project demands.

Support full semiconductor production workflow. Keep chips stable in high‑temp working environment. Bring steady protection across testing assembling and component shipment.

Key Features/ Benefits

Made of durable PPE raw material
Heat-proof and anti-contamination
Anti‑static performance guard IC components
More than 12 years of export experience.
With professional engineers and efficient management.

Specifications

Brand		Hiner-pack
Model		HN25074
Material		PPE
Package Type		JEDEC
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		322.6×135.9×9.35 mm
Cavity Size		25×16×2.25 mm
Matrix QTY		4×14＝56 PCS
Warpage		MAX 0.76mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Suit semiconductor chip testing and high‑temperature production processes. Hold IC parts steady inside automated assembly lines.

Fit bulk component storage and cross‑border shipment. Protect sensitive semiconductor units. Accept special custom solutions for non‑standard chip models.

Packaging & Shipping/ Services

Stack neatly with protective separators inside thick cartons. Prevent bump and scratch during internal handling.

Support sea air and express delivery. Maintain stable lead time. Reinforced outer packing reduce risk for long‑distance global transport.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / Waffle Pack Trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

Tags:

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

Customizable Cavity PPE JEDEC IC Trays Heat‑Resistant For Semiconductor Packaging

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