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Heat‑Resistant PPE JEDEC IC Trays Offer Stable IC Protection In Handling And Transport

Brand Name:	Hiner-pack
Model Number:	HN25081
MOQ:	500 pcs
Price:	$1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
Payment Terms:	T/T
Supply Ability:	2000PCS/Day

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

ROHS, ISO

Tray Weight:

Varies, Typically Up To 500 Grams Per Cavity

Color:

Black

Quality Assurance:

Delivery Guarantee, Reliable Quality

Cavity Size:

9.81×10.87×1.5 Mm

Incoterms:

EXW, FOB, CIF, DDU, DDP

Mold Type:

Injection

Reusable:

Yes

Tray Shape:

Rectangular

Clean Class:

General And Ultrasonic Cleaning

Ic Type:

BGA,QFP,QFN,LGA,PGA

Packing Level:

Transport Package

Flatness:

Less Than 0.76mm

Capacity:

3×5＝15 PCS

Packaging Details:

CARTON, PALLET

Supply Ability:

2000PCS/Day

Product Description

Heat‑Resistant PPE JEDEC IC Trays Offer Stable IC Protection In Handling And Transport

Searching reliable protection for sensitive IC chips? Built from high‑grade PPE, withstand high‑temperature working conditions. Shield delicate semiconductor parts from scratch and contamination in daily operations.

Match multiple chip specifications. Custom cavity solution stands as core offer. Adjust cavity size and layout to satisfy different semiconductor project needs.

Fit whole semiconductor production flow. Keep IC components secure through testing, assembling and shipment. Bring consistent protection across various operating scenarios.

Key Features/ Benefits

Constructed from robust PPE raw material
ISO certified production
Anti‑static property safeguard IC devices
Fit automated semiconductor production lines
Support full cavity custom modification

Specifications

Brand		Hiner-pack
Model		HN25081
Material		MPPO
Package Type		JEDEC
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		322.6×135.9×9.35 mm
Cavity Size		50×30×2.75 mm
Matrix QTY		3×5＝15 PCS
Warpage		MAX 0.76mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Apply to semiconductor chip testing and high‑temperature manufacturing. Keep IC components stable within automated assembly workflows.

Work for mass component storage and cross‑border transportation. Protect delicate semiconductor parts. Handle special requirements for non‑standard chip models.

Customized Services

Offer full custom for cavity dimension and layout. Modify overall tray size to fit unique chip samples. Accept drawing‑based development for special semiconductor projects.

Support sample confirmation before bulk order. Flexible adjust parameters to meet project targets. Deliver tailored solutions for diverse client demands.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / Waffle Pack Trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

Tags:

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

Heat‑Resistant PPE JEDEC IC Trays Offer Stable IC Protection In Handling And Transport

Heat‑Resistant PPE JEDEC IC Trays Offer Stable IC Protection In Handling And Transport

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