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JEDEC IC Trays Reduce Dust And Protect Delicate Semiconductor Wafers During Packaging

Brand Name:	Hiner-pack
Model Number:	HN25089
MOQ:	500 pcs
Price:	$1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
Payment Terms:	T/T
Supply Ability:	2000PCS/Day

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

ROHS, ISO

Tray Weight:

Varies, Typically Up To 500 Grams Per Cavity

Color:

Black

Quality Assurance:

Delivery Guarantee, Reliable Quality

Cavity Size:

18×41.8×7.7 Mm

Incoterms:

EXW, FOB, CIF, DDU, DDP

Mold Type:

Injection

Reusable:

Yes

Tray Shape:

Rectangular

Clean Class:

General And Ultrasonic Cleaning

Ic Type:

BGA,QFP,QFN,LGA,PGA

Packing Level:

Transport Package

Flatness:

Less Than 0.76mm

Capacity:

5X6=30 PCS

Packaging Details:

CARTON, PALLET

Supply Ability:

2000PCS/Day

Product Description

JEDEC IC Trays Reduce Dust And Protect Delicate Semiconductor Wafers During Packaging

Constructed from high‑grade PPE raw material, sustain maximum 150℃ working temperature. Deliver stable anti‑static performance, keep away dust particles that damage sensitive chips. Stand repeated stacking and circulation inside semiconductor manufacturing workshops.

Focus on flexible cavity customization as core strength. Adjust slot shape, inner dimension and overall tray outline. Match diverse chip specifications, accept project development based on customer‑provided samples or technical drawings.

Fit automatic packaging and production workflows. Secure fragile chips firmly inside molded slots. Offer steady protection running from component loading, processing until finished‑product outbound delivery.

Key Features/ Benefits

PPE high‑temperature resistant material.
Reduce dust contamination.
Safeguard wafer packaging processes.
Comply with JEDEC standards.
Support custom design solutions.

Specifications

Brand		Hiner-pack
Model		HN25089
Material		PPE
Package Type		JEDEC
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		322.6×135.9×13.19 mm
Cavity Size		18×41.8×7.7 mm
Matrix QTY		5X6=30 PCS
Warpage		MAX 0.76mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Work for semiconductor chip packaging and high‑temperature assembly processes. Hold fragile chips steady during automated operations to avoid scratch and particle pollution.

Suitable for chip internal storage and inter‑workshop transit. Prevent dust and static harm to sensitive devices. Realize personalized modification for special non‑standard chip types.

Packaging & Shipping/ Services

Stack finished trays with protective separator boards, then pack into thickened carton boxes. Reduce scratch and collision risks during factory‑site handling and stock movement.

Support sea, air and express shipment modes. Maintain predictable production lead‑time. Apply reinforced outer package to lower damage risk for long‑distance overseas transportation.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / Waffle Pack Trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

Tags:

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

JEDEC IC Trays Reduce Dust And Protect Delicate Semiconductor Wafers During Packaging

JEDEC IC Trays Reduce Dust And Protect Delicate Semiconductor Wafers During Packaging

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