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PC Anti Static Waffle Pack Chip Tray for Semiconductor Storage

PC Anti Static Waffle Pack Chip Tray for Semiconductor Storage

Brand Name: Hiner-pack
Model Number: HN25197
MOQ: 1000
Price: $1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities)
Payment Terms: T/T
Supply Ability: 2000PCS/Day
Detail Information
Place of Origin:
China
Certification:
ROHS, ISO
Tray Weight:
Varies, Typically Up To 500 Grams Per Cavity
Color:
Black
Quality Assurance:
Delivery Guarantee, Reliable Quality
Outline Line Size:
101.6×101.6×7.28 Mm
Cavity Size:
3.28×6.64×1.28 Mm
Incoterms:
EXW, FOB, CIF, DDU, DDP
Mold Type:
Injection
Reusable:
Yes
Tray Shape:
Rectangular
Clean Class:
General And Ultrasonic Cleaning
Ic Type:
BGA,QFP,QFN,LGA,PGA
Packing Level:
Transport Package
Warpage:
Warpage MAX 0.22mm
Capacity:
8×16=128 PCS
Packaging Details:
CARTON, PALLET
Supply Ability:
2000PCS/Day
Product Description
PC Anti Static Waffle Pack Chip Tray for Semiconductor Storage
Fabricated from high-performance rigid PC material, these waffle pack IC trays deliver stable ESD protection for fragile semiconductor chips. Precision cavity layout keeps chips securely positioned and reduces scratches and collision risks during handling. Multiple thickness grades are available to fit different operating conditions.

These trays fit perfectly into ESD-controlled workshops and automatic production lines. They support high-precision chip processing, component sorting, device testing and internal factory transfer. Reliable performance makes them a common choice for IC packaging factories and electronic component suppliers.


Custom modifications are available to meet unique project needs. Cavity size, spacing, layout and outer dimensions can be adjusted according to chip specifications and automation equipment. Tailored designs help optimize packaging efficiency and keep chips safe throughout storage and transit.

Key Features/ Benefits 
  • Precision cavity layout
  • Durable construction
  • Secure chip holding
  • Durable rigid PC construction for long-term repeated stacking and circulation
  • The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
Brand Hiner-pack
Model HN25197
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 101.6×101.6×7.28 mm
Cavity Size  3.28×6.64×1.28 mm
Matrix QTY  8×16=128 PCS
Warpage  MAX 0.22mm
Service  Accept OEM, ODM
Custom Pocket Options  Available
Applications
Suitable for high-precision chip processing, component sorting, electrical device testing and small semiconductor device assembly. Work well in automatic production lines and strict static-controlled workshops.

Ideal for factory internal transportation, work-in-progress storage and finished component stocking. Widely adopted by chip manufacturers, IC packaging plants and electronic component suppliers.
Customized Services
Provide fully customized solutions for PC ESD waffle pack IC trays. Adjust cavity size, spacing, layout, tray thickness and outer dimensions to fit diverse chip dimensions and special handling requirements. Support design adjustment according to customer drawings and automation equipment specifications.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / Waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers