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Waffle Pack Chip Trays for Protecting Semiconductor IC Chips from Friction and Mechanical Damage

Brand Name:	Hiner-pack
Model Number:	HN25204
MOQ:	1000
Price:	$1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）
Payment Terms:	T/T
Supply Ability:	2000PCS/Day

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

ROHS, ISO

Tray Weight:

Varies, Typically Up To 500 Grams Per Cavity

Color:

Black

Quality Assurance:

Delivery Guarantee, Reliable Quality

Outline Line Size:

101.6×101.6×5.5 Mm

Cavity Size:

5.25×4.0×1.2 Mm

Incoterms:

EXW, FOB, CIF, DDU, DDP

Mold Type:

Injection

Reusable:

Yes

Tray Shape:

Rectangular

Clean Class:

General And Ultrasonic Cleaning

Ic Type:

BGA,QFP,QFN,LGA,PGA

Packing Level:

Transport Package

Warpage:

Warpage MAX 0.23mm

Capacity:

12×14=168 PCS

Packaging Details:

CARTON, PALLET

Supply Ability:

2000PCS/Day

Product Description

Waffle Pack Chip Trays for Protecting Semiconductor IC Chips from Friction and Mechanical Damage

Precise matrix cavities separate delicate IC chips and limit abrasion during handling. Stable anti-static performance stops electrostatic harm to sensitive semiconductor parts. Want dependable protection for high-value components through repeated stacking cycles? Consistent shielding cuts part damage risk.

Fit ESD controlled workshops and automated test equipment. Handle chip sorting, electrical inspection and cross plant transfer. Keep components safe from packing until final assembly. Gain reliable performance favored by IC packaging and semiconductor manufacturers.

Full custom service available. Tune cavity shape, arrangement and outer dimensions to fit special chip outlines and automation needs. Customized structures simplify production flows and lower component loss for mass production orders.

Key Features/ Benefits

Stable conductive ESD performance
Precision matrix cavity layout
Resist friction and mechanical scratches
Secure chip holding
Support custom specifications
The factory has ISO certification, and the products comply with the RoHS standard.

Specifications

Brand		Hiner-pack
Model		HN25204
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		101.6×101.6×5.5 mm
Cavity Size		5.25×4.0×1.2 mm
Matrix QTY		12×14=168 PCS
Warpage		MAX 0.23mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Serve semiconductor IC testing, component sorting and precision inspection. Match automatic handling machines inside ESD production zones.

Fit temporary chip storage, internal transit and component packaging. Widely used by IC packaging factories and electronic manufacturers.

Customized Services

Customization service stands as core support for diverse semiconductor projects. Pocket dimensions, cavity layout, marking positions and outer sizes can all be developed as requested. Professional technical team backs prototype evaluation, sample testing and mass production. Flexible adjustments meet unique automation and packaging needs to cut component waste for different chip types.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / Waffle pack trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

Tags:

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

Waffle Pack Chip Trays for Protecting Semiconductor IC Chips from Friction and Mechanical Damage

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