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Waffle Pack Chip Trays ESD Cleanroom Trays for Contamination Control and IC Protection

Brand Name:	Hiner-pack
Model Number:	HN25211
MOQ:	1000
Price:	$1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
Payment Terms:	T/T
Supply Ability:	2000PCS/Day

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

ROHS, ISO

Color:

Usually Black

Quality Assurance:

Delivery Guarantee, Reliable Quality

Cavity Size:

10.36×12.36×1.00 Mm

Incoterms:

EXW, FOB, CIF, DDU, DDP

Mold Type:

Injection

Reusable:

Yes

Tray Shape:

Rectangular

Clean Class:

General And Ultrasonic Cleaning

Ic Type:

BGA,QFP,QFN,LGA,PGA

Packing Level:

Transport Package

Warpage:

Warpage MAX 0.25mm

Capacity:

6×7-1=41 PCS

Packaging Details:

CARTON, PALLET

Supply Ability:

2000PCS/Day

Product Description

Cleanroom Waffle Pack Trays for IC Protection

Precision grid cavities separate single chips and reduce friction damage during frequent handling. Reliable static dissipative material protects fragile semiconductor dies from ESD surge. Looking for stable component protection for cleanroom production? Solid shielding effectively cut reject rate in chip processing.

Match automatic test machines and ESD controlled work areas. Enable chip sorting electrical check and cross workshop transfer. Secure parts all the way from loading to final packaging. Earn consistent recognition from IC packaging factories.

Have special chip dimension requirements? Custom solutions adjust pocket size marking and tray outline. Flexible layouts adapt to different automation lines and fit non standard components.

Key Features/ Benefits

Precision grid cavity structure
Permanent ESD dissipation
Suitable for Delicate Fine Pitch ICs
More than 12 years of export experience.
Guards ESD-sensitive fine pitch integrated circuits
The factory has ISO certification, and the products comply with the RoHS standard.

Specifications

Brand		Hiner-pack
Model		HN25211
Color		Usually black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		101.6×101.6×8 mm
Cavity Size		10.36×12.36×1.00 mm
Matrix QTY		6×7-1=41 PCS
Warpage		MAX 0.25mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Fit semiconductor IC testing sorting and precision inspection. Work well with automatic pick and place equipment inside cleanroom environments.

Great for short term chip storage internal logistics and component packing. Popular among semiconductor packaging and electronic component makers.

Customized Services

Custom service includes pocket size cavity pattern marking and overall dimension. Engineering team offers prototype verification sample trial and bulk manufacturing. Tailor trays to fit special automation lines for unique chip projects.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / Waffle Pack Trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

Tags:

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

Waffle Pack Chip Trays ESD Cleanroom Trays for Contamination Control and IC Protection

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