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Durable Waffle Pack Chip Trays Precision Grid Cavities for Semiconductor Chip Protection

Brand Name:	Hiner-pack
Model Number:	HN25225
MOQ:	1000
Price:	$1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）
Payment Terms:	T/T
Supply Ability:	2000PCS/Day

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

ROHS, ISO

Tray Weight:

Varies, Typically Up To 500 Grams Per Cavity

Color:

Black

Quality Assurance:

Delivery Guarantee, Reliable Quality

Outline Line Size:

101.6×101.6×8 Mm

Cavity Size:

6.30×4.5×0.53 Mm

Incoterms:

EXW, FOB, CIF, DDU, DDP

Mold Type:

Injection

Reusable:

Yes

Tray Shape:

Rectangular

Clean Class:

General And Ultrasonic Cleaning

Ic Type:

BGA,QFP,QFN,LGA,PGA

Packing Level:

Transport Package

Warpage:

Warpage MAX 0.23mm

Capacity:

11×13=143 PCS

Packaging Details:

CARTON, PALLET

Supply Ability:

2000PCS/Day

Product Description

Durable Waffle Pack Chip Trays Precision Grid Cavities for Semiconductor Chip Protection

Made of solid PC material offered in black and red for visual distinction. Precision grid cavities separate individual chips and lower friction damage during repeated handling. Stable static dissipative property guards delicate semiconductor units from ESD risk. Search robust trays to fit high frequency chip testing workflows? Consistent protection cuts component loss in daily operation.

Fit automatic test handlers and ESD controlled workshops. Support chip sorting electrical inspection and cross workshop transfer. Secure parts from loading until final packaging. Gain steady performance favored by semiconductor packaging factories.

Need unique cavity sizes or special marking? Custom options adjust pocket dimension tray outline and color. Flexible layouts adapt to different automation lines for non standard chips.

Key Features/ Benefits

Reliable ESD protection for sensitive semiconductor parts
Precise grid cavities for stable component holding
Custom cavity available
Anti scratch anti contamination
Black and red color option

Specifications

Brand		Hiner-pack
Model		HN25225
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		101.6×101.6×8 mm
Cavity Size		6.30×4.5×0.53 mm
Matrix QTY		11×13=143 PCS
Warpage		MAX 0.23mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Suit semiconductor IC testing sorting and precision inspection. Match automatic pick and place machines inside cleanroom environments.

Work well for temporary chip storage internal transit and component packing. Widely used by semiconductor packaging and electronic manufacturers.

Packaging & Shipping/ Services

Secure packing methods protect trays against impact during transit. Multiple shipping options available to meet different lead time demands.

Trackable delivery updates keep customers informed until goods safely arrive at destination.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / Waffle Pack Trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

Tags:

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

Durable Waffle Pack Chip Trays Precision Grid Cavities for Semiconductor Chip Protection

Durable Waffle Pack Chip Trays Precision Grid Cavities for Semiconductor Chip Protection

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