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Precision Grid Waffle Pack Chip Trays Solid PC for Semiconductor ESD Protection

Brand Name:	Hiner-pack
Model Number:	HN25227
MOQ:	1000
Price:	$1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）
Payment Terms:	T/T
Supply Ability:	2000PCS/Day

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

ROHS, ISO

Tray Weight:

Varies, Typically Up To 500 Grams Per Cavity

Color:

Black

Quality Assurance:

Delivery Guarantee, Reliable Quality

Outline Line Size:

101.6×101.6×7

Cavity Size:

11.55×12.85×6.45 Mm

Incoterms:

EXW, FOB, CIF, DDU, DDP

Mold Type:

Injection

Reusable:

Yes

Tray Shape:

Rectangular

Clean Class:

General And Ultrasonic Cleaning

Ic Type:

BGA,QFP,QFN,LGA,PGA

Packing Level:

Transport Package

Warpage:

Warpage MAX 0.23mm

Capacity:

3×4=12 PCS

Packaging Details:

CARTON, PALLET

Supply Ability:

2000PCS/Day

Product Description

Precision Grid Waffle Pack Chip Trays Solid PC for Semiconductor ESD Protection

Fabricated from rigid PC material with static dissipative property. Precision shaped cavities firmly lock components and avoid shifting during handling. Smooth surface cuts abrasion risk for fragile semiconductor units. Looking for reliable carriers for automated testing lines? Stable ESD performance effectively prevent electrostatic damage.

Fit automatic test equipment and controlled ESD work zones. Support component sorting inspection and batch transfer. Secure parts all the way from loading to final packing. Gain trust from semiconductor assembly factories.

Have special component outline requirements? Custom cavity shape marking and tray dimension available. Flexible designs match unique automation processes for non-standard parts.

Key Features/ Benefits

Reliable ESD protection for sensitive semiconductor parts
Precision shaped cavities
Custom cavity design available
Anti scratch anti contamination
Black and red color option

Specifications

Brand		Hiner-pack
Model		HN25227
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		101.6×101.6×7
Cavity Size		11.55×12.85×6.45 mm
Matrix QTY		3×4=12 PCS
Warpage		MAX 0.23mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Suit semiconductor component testing sorting and inspection. Compatible with automatic pick and place machines inside cleanroom environments.

Work well for batch component storage in-house circulation and transit. Widely adopted by semiconductor assembly and electronic manufacturing plants.

Packaging & Shipping/ Services

Protective outer packing absorb impact during shipment. Multiple shipping modes satisfy different delivery schedules.

Real-time tracking available for cargo status. Goods carefully packed to avoid deformation and scratches before dispatch to destinations worldwide.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / Waffle Pack Trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

Tags:

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

Precision Grid Waffle Pack Chip Trays Solid PC for Semiconductor ESD Protection

Precision Grid Waffle Pack Chip Trays Solid PC for Semiconductor ESD Protection

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