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Precision Molded Static Dissipative ABS Waffle Pack Chip Trays

Brand Name:	Hiner-pack
Model Number:	HN25248
MOQ:	1000
Price:	$1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）
Payment Terms:	T/T
Supply Ability:	2000PCS/Day

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

ROHS, ISO

Tray Weight:

Varies, Typically Up To 500 Grams Per Cavity

Color:

Black

Quality Assurance:

Delivery Guarantee, Reliable Quality

Outline Line Size:

101.6×101.6×5.5 Mm

Cavity Size:

6.15×3.35×0.75 Mm /5.50×4.00×1.22 Mm

Incoterms:

EXW, FOB, CIF, DDU, DDP

Mold Type:

Injection

Reusable:

Yes

Tray Shape:

Rectangular

Clean Class:

General And Ultrasonic Cleaning

Ic Type:

BGA,QFP,QFN,LGA,PGA

Packing Level:

Transport Package

Warpage:

Warpage MAX 0.23mm

Capacity:

10×12=120 PCS

Packaging Details:

CARTON, PALLET

Supply Ability:

2000PCS/Day

Product Description

Precision Molded Static Dissipative ABS Waffle Pack Chip Trays

Made of rigid static dissipative ABS material with smooth finish. Regular grid cavities hold chips steadily and prevent shifting during handling. Low-friction surface cut scratch risk for delicate semiconductor dies. Search stable carriers for chip storage and testing? Consistent ESD protection block static damage.

Fit automatic pick and place equipment and ESD controlled cleanrooms. Support chip sorting inspection and batch transfer. Protect chips from loading until final packing. Widely chosen by semiconductor packaging manufacturers.

Have special chip dimension demands? Custom molding service available. Tailored grid patterns match unique chip sizes and automated production lines.

Key Features/ Benefits

Reliable ESD protection for sensitive semiconductor parts
Stable static dissipative property
Smooth scratch-resistant surface
Anti scratch anti contamination
Black and red color option

Specifications

Brand		Hiner-pack
Model		HN25248
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		101.6×101.6×5.5 mm
Cavity Size		6.15×3.35×0.75 mm 5.50×4.00×1.22 mm
Matrix QTY		10×12=120 PCS
Warpage		MAX 0.23mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Suitable for semiconductor chip testing sorting and visual inspection. Compatible with automatic handling machines inside cleanroom workshops.

Fit batch chip storage internal circulation and transit. Commonly used by IC packaging and electronic component manufacturers.

Packaging & Shipping/ Services

Sturdy outer packaging buffer impact during shipment. Multiple shipping ways meet different lead time demands.

Real-time cargo tracking accessible. Goods carefully wrapped to avoid deformation and surface abrasion before delivery.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / Waffle Pack Trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

Tags:

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

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