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Precision Engineered Solid PC Waffle Pack Chip Trays with ESD Protection for IC Chip Trays

Brand Name:	Hiner-pack
Model Number:	HN25249
MOQ:	1000
Price:	$1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）
Payment Terms:	T/T
Supply Ability:	2000PCS/Day

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

ROHS, ISO

Tray Weight:

Varies, Typically Up To 500 Grams Per Cavity

Color:

Black

Quality Assurance:

Delivery Guarantee, Reliable Quality

Outline Line Size:

101.6×101.6×7 Mm

Cavity Size:

20.25×10×0.1 Mm

Incoterms:

EXW, FOB, CIF, DDU, DDP

Mold Type:

Injection

Reusable:

Yes

Tray Shape:

Rectangular

Clean Class:

General And Ultrasonic Cleaning

Ic Type:

BGA,QFP,QFN,LGA,PGA

Packing Level:

Transport Package

Warpage:

Warpage MAX 0.23mm

Capacity:

4×7=28 PCS

Packaging Details:

CARTON, PALLET

Supply Ability:

2000PCS/Day

Highlight:

Solid PC Waffle Pack Chip Trays

ESD Protection Waffle Pack Trays

Precision Engineered Chip Trays

Product Description

Precision Engineered Waffle Pack Chip Trays Solid PC for ESD Protection

Searching for reliable carrier for fragile IC parts? Hold tiny chips firmly inside neatly molded cavities. Block static charge buildup and avoid sudden electrostatic harm across production links. Keep every single component fixed without shifting during movement.

Feature rigid flat panel design with evenly arranged pockets. Fit automated test fixtures and pick place equipment perfectly. Cut abrasion and collision risk during repeated handling, inspection and transfer. Maintain consistent performance after long time circulation.

Accept custom cavity shapes depths and overall tray dimensions. Adjust layout to match unique chip outlines and footprint. Support small batch and mass production projects. Meet diverse requirements from electronic and semiconductor manufacturers.

Key Features/ Benefits

Precision shaped molded cavities
Precision shaped molded cavities
Anti scratch anti contamination
Anti scratch anti contamination
Black and red color option

Specifications

Brand		Hiner-pack
Model		HN25249
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		101.6×101.6×7.8 mm
Cavity Size		20.25×10×0.1 mm
Matrix QTY		4×7=28 PCS
Warpage		MAX 0.23mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Support semiconductor production and chip testing workflows. Carry ICs while sorting and quality checking. Enable smooth part circulation inside workshops and assembly lines.

Fit electronic parts warehouse keeping. Support bulk chip outbound transport. Preserve component integrity before final assembly and packaging.

Packaging & Shipping/ Services

Pack inside anti static bags then export cartons. Proper stacking avoid surface marks. Provide various shipping choices. Track shipments after sending. Ensure safe arrival to worldwide clients.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / Waffle Pack Trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

Tags:

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

Precision Engineered Solid PC Waffle Pack Chip Trays with ESD Protection for IC Chip Trays

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