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Durable Waffle Pack Chip Trays for Safe Handling of Semiconductor Components and IC Chip Trays

Durable Waffle Pack Chip Trays for Safe Handling of Semiconductor Components and IC Chip Trays

Brand Name: Hiner-pack
Model Number: HN25252
MOQ: 1000
Price: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
Payment Terms: T/T
Supply Ability: 2000PCS/Day
Detail Information
Place of Origin:
China
Certification:
ROHS, ISO
Color:
Usually Black
Quality Assurance:
Delivery Guarantee, Reliable Quality
Cavity Size:
3.15×6.5×1.28 Mm
Incoterms:
EXW, FOB, CIF, DDU, DDP
Mold Type:
Injection
Reusable:
Yes
Tray Shape:
Rectangular
Clean Class:
General And Ultrasonic Cleaning
Ic Type:
BGA,QFP,QFN,LGA,PGA
Packing Level:
Transport Package
Warpage:
Warpage MAX 0.25mm
Capacity:
8×16=128 PCS
Packaging Details:
CARTON, PALLET
Supply Ability:
2000PCS/Day
Highlight:

Durable Waffle Pack Chip Trays

,

Waffle Pack Trays For Semiconductor Handling

,

Safe Semiconductor Component Waffle Trays

Product Description
Durable Waffle Pack Chip Trays For Safe Semiconductor Component Handling

Looking for sturdy carriers to guard fragile semiconductor components? Hold chips firmly inside precisely molded cavities. Lower friction and collision risks during continuous handling. Keep components stable without shifting through testing and sorting steps.


Built with rigid PC material for long repeated use. Feature neat ordered pocket layout. Match automated pick and test equipment smoothly. Maintain consistent anti static performance in cleanroom working environments.


Support custom cavity shape and dimension adjustment. Modify layout to fit unique chip specifications. Adapt to small trial orders and large volume manufacturing demands. Satisfy varied packaging needs from electronic factories.

Key Features/ Benefits 
  • Durable PC material construction
  • Custom cavity layout available
  • Suitable for Delicate Fine Pitch ICs
  • More than 12 years of export experience.
  • Guards ESD-sensitive fine pitch integrated circuits
  • The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
Brand Hiner-pack
Model HN25252
Color Usually black 
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 101.6×101.6×7.28 mm
Cavity Size 3.15×6.5×1.28 mm
Matrix QTY 8×16=128 PCS
Warpage MAX 0.25mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications

Serve semiconductor assembly and chip testing lines. Secure IC units during inspection and sorting. Enable smooth circulation inside cleanroom workshops.


Support electronic component warehouse storage. Protect chips during batch outbound shipment. Keep parts intact before final packaging.

Customized Services
Offer full customization for tray cavity shape size and layout. Adjust overall dimensions to match different chip footprints. Support sample making for validation before mass production. Accept small trial orders and bulk orders.

Modify surface performance to meet special cleanroom requirements. Flexible production schedule to shorten lead time. Provide professional technical support through whole project.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / Waffle Pack Trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers